Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment Results from European Collaborative “SEAL” Project


Article Preview

Based on recent progress on laser-based wafer dicing equipment and process, the partners adixen, Fraunhofer IISB and JENOPTIK investigated the use of a vacuum based decontamination process to dry and to decontaminate the substrate surface of the diced wafers from water residuals, which are a side-effect of the TLS (thermal laser separation) approach. The decontamination process was achieved by using an adixen vacuum drying module prototype further to the JENOPTIK TLS dicing process. Within the frame of the European collaborative project SEAL, supported by the European Commission, experimental assessment was conducted by Fraunhofer IISB (research institution) together with JENOPTIK and Adixen.



Solid State Phenomena (Volume 195)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns




O. Le Barillec et al., "Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment Results from European Collaborative “SEAL” Project", Solid State Phenomena, Vol. 195, pp. 252-257, 2013

Online since:

December 2012




[1] H. -U. Zühlke; Thermal laser separation for wafer dicing;, Solid State Technology, (2009).

[2] D. Lewke, M. Koitzsch, M. Schellenberger, L. Pfitzner, H. Ryssel, Ablation Free Dicing of 4H-SiC Wafers with Feed Rates up to 200 mm/s by Using Thermal Laser Separation, MRS-Spring Meeting, San Francisco, (2012).

DOI: 10.1557/opl.2012.1035

[3] M. Koitzsch, D. Lewke, M. Schellenberger, L. Pfitzner, H. Ryssel, H. -U. Zühlke, Enhancements in Resizing Single Crystalline Silicon Wafers up to 450 mm by using Thermal Laser Separation, ASMC 2012; pp.336-341.

DOI: 10.1109/asmc.2012.6212923

[4] M. M. Gatzen, C. Morsbach, M. Tricad, Dual Wheel Miniature Gang for Silicon Wafer dicing, Proc. Of 2nd euspen International Conference – Turin, Italy, (2001).

[5] B. N. Chichkov, Femtosecond, Picosecond and Nanosecond Laser Ablation of Solids, J. of Appl. Phys., A 63, pp.109-115, (1996).

DOI: 10.1007/bf01567637

[6] B. Richerzhagen, The best of both worlds - Laser and water jet combined in a new process: The water jet guided laser, 20TH ICALEO 2001, VOLS 92 & 93, CONGRESS PROCEEDINGS, p.1815–1824, (2001).

[7] M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, K. Fukumitsu, Advanced dicing technology for semiconductor wafer - Stealth dicing, IEEE T SEMICONDUCT M, vol. 20, no. 3, p.259–265, (2007).

DOI: 10.1109/tsm.2007.901849

[8] Disco, Automatic cleaning system: DCS 141, User Manual, (2005).

[9] J. W. Knutti, H. V. Allen, Trends in MEMS Commerzialization; in Baltes, Brand, Fedder, Hierold, Korvink, Tabata (Eds. ), Advanced Micro & Nanosystems, Volume 1 Enabling Technology for MEMS and Nanodevices; WILEY-VCH Verlag GmbH & Co. KGaA, 2004, pp.21-47.

DOI: 10.1002/9783527616701

Fetching data from Crossref.
This may take some time to load.