Paper Title:
Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment Results from European Collaborative “SEAL” Project
  Abstract

Based on recent progress on laser-based wafer dicing equipment and process, the partners adixen, Fraunhofer IISB and JENOPTIK investigated the use of a vacuum based decontamination process to dry and to decontaminate the substrate surface of the diced wafers from water residuals, which are a side-effect of the TLS (thermal laser separation) approach. The decontamination process was achieved by using an adixen vacuum drying module prototype further to the JENOPTIK TLS dicing process. Within the frame of the European collaborative project SEAL, supported by the European Commission, experimental assessment was conducted by Fraunhofer IISB (research institution) together with JENOPTIK and Adixen.

  Info
Periodical
Solid State Phenomena (Volume 195)
Chapter
Chapter 6: Wetting and Drying
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
252-257
DOI
10.4028/www.scientific.net/SSP.195.252
Citation
O. Le Barillec, M. Davenet, A. Favre, B. Bellet, M. Koitzsch, D. Lewke, M. Schellenberger, H. U. Zühlke, "Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment Results from European Collaborative “SEAL” Project", Solid State Phenomena, Vol. 195, pp. 252-257, 2013
Online since
December 2012
Export
Price
$35.00
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