Simulating Nanoindentation of Thin Cu Films Using Molecular Dynamics and Peridynamics


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Nanoindentation is a useful experimental method to characterize the micromechanical properties of materials. In this study molecular dynamics and peridynamics are used to simulate nanoindentation, with a spherical indenter targeting a thin single crystal Cu film, resting on an infinitely stiff substrate. The objective is to compare the results obtained from molecular dynamic simulations to those obtained using a peridynamic approach as regards the force-displacement curves and the deformation patterns after that the material parameters in the peridynamic model have been fitted to the force displacement curve from the molecular dynamic simulation.



Solid State Phenomena (Volume 258)

Edited by:

Pavel Šandera




A. Ahadi et al., "Simulating Nanoindentation of Thin Cu Films Using Molecular Dynamics and Peridynamics", Solid State Phenomena, Vol. 258, pp. 25-28, 2017

Online since:

December 2016




* - Corresponding Author

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