Electronic Packaging Interconnect Technology

Electronic Packaging Interconnect Technology

Description:

This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.

Keywords:
Brazing, Chemical Technologies, Corrosion, Interconnection, Intermetallic Compounds, Lead-Free Solder Alloys, Liquid Structure, Mechanical Properties, Photochemistry, Polymers, Solder, Solder Alloys, Solidification, Whisker Growth

Ringgold Subjects:

Materials Science

Info:

ISBN-13:
978-3-0357-1324-4
Editors:
Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir
Pages:
210
Year:
2018
Edition:
softcover

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