Microstructure of Semi-Solid Extruded Copper Alloy after Heat Treatment

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The semi-solid extruded ZCuSn10P1 copper alloy were annealed at different temperatures and time. The influences of heat treatment temperature and holding time on the microstructure of semi-solid ZCuSn10P1 copper alloy were investigated. The results show that with the increase of heat treatment temperature, the morphology of the semi-solid microstructure was improved, the sharp angle around the primary phase α-Cu and the liquid droplets were reduced. With the increase of heat treatment time, the solid-liquid segregation of the semi-solid structure was improved. The average grain size of the solid phase increased with the increasing of the holding time. After heat treatment, the solid solubility of the primary phase α-Cu increased, and the Sn and P elements in the liquid phase continued to diffuse to the primary phase α-Cu. The microstructure of semi-solid copper alloy was the most uniform after heat treatment at 350°C for 120 min.

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Periodical:

Solid State Phenomena (Volume 285)

Edited by:

Qiang Zhu, Ahmed Rassili, Stephen P. Midson and Xiao Gang Hu

Pages:

146-152

Citation:

N. Y. Li et al., "Microstructure of Semi-Solid Extruded Copper Alloy after Heat Treatment", Solid State Phenomena, Vol. 285, pp. 146-152, 2019

Online since:

January 2019

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$41.00

* - Corresponding Author

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