Papers by Author: Dae Geun Kim

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Authors: Dae Geun Kim, Jin Soo Bae, Jae Ho Lee, Yang Do Kim, Yoo Min Ahn
Abstract: Electroless copper plating was investigated for the electronics applications, such as a metallization for ULSI and MEMS etc. The role of electrolyte composition on the kinetics and mechanism of the electroless copper deposition process was described. Electrochemical techniques were employed for the investigations. The mixed potential and current were determined and then those were compared with experimental deposition rate. The kinetics is strongly influenced by the pretreatment and additive concentrations.
Authors: Dae Geun Kim, Jae Ho Lee
Abstract: The codeposition of fine WC and Co coated WC particles from nickel Watt’s bath has been investigated. Electroplating of Ni/WC and Ni/WC(Co) composites coating were carried out at different current density with variation of particle size. The effect of hydrodynamic conditions of the codeposition of Ni/WC bath has been investigated. The Guglielmi adsorption mechanism is applied to the electroplating of the fine WC and WC(Co) in Ni matrix. The adsorption rate of determination step is controlled by the transferal process of loose adsorption to strong adsorption. The embedded WC concentration can be increased both by increasing electrical current density and additional WC concentration in the bath.
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