Papers by Author: Dethard Peters

Paper TitlePage

Authors: Dethard Peters, Thomas Aichinger, Thomas Basler, Wolfgang Bergner, Daniel Kueck, Romain Esteve
Abstract: A detailed analysis of the typical static and dynamic performance of the new developed Infineon 1200V CoolSiCTM MOSFET is shown which is designed for an on-resistance of 45 mΩ. In order to be compatible to various standard gate drivers the gate voltage range is designed for-5 V in off-state and +15 V in on-state. Long term gate oxide life time tests reveal that the extrinsic failure evolution follows the linear E-model which allows a confident prediction of the failure rate within the life time of the device of 0.2 ppm in 20 years under specified use condition.
Authors: Dethard Peters, Karl Otto Dohnke, Christian Hecht, Dietrich Stephani
Authors: Dethard Peters, Adolf Schöner, Peter Friedrichs, Dietrich Stephani
Authors: Dethard Peters, Wolfgang Bartsch, Bernd Thomas, R. Sommer
Abstract: The paper compares static and dynamic characteristics of 6.5 kV SiC PiN diodes fabricated with different p-emitters. The version with the thickest p-emitter (4 µm) showed the lowest forward voltage (3.4 V at 100 A/cm²) and the lowest (negative) temperature coefficient. Forward voltage DC stress tests revealed a stability within the measurement error of the test apparatus (<50 mV). The dynamic performance showed a soft recovery even at 4 kV. The reverse recovery charge Qrr is analyzed for different forward currents and junction temperatures. The dynamic losses of the SiC PiN diode are marginal with view to the application in industrial inverters.
Authors: Michael Treu, Roland Rupp, Chee Siew Tai, Peter Blaschitz, Jochen Hilsenbeck, Helmut Brunner, Dethard Peters, Rudolf Elpelt, T. Reimann
Abstract: Today silicon carbide (SiC) Schottky diodes are mainly used in the power factor control (PFC) unit of high end switched mode power supplies, due to their outstanding switching performance compared to Si pn diodes. In the case of the PFC it is required that the diodes are capable of handling surge currents up to several times the current of normal operation. The paper shows the surge current capability of a merged pn Schottky diode where the p-areas are optimized as efficient emitters. During normal operation the diode is behaving like a normal Schottky diode whereas during surge current condition the diode is behaving like a pn diode. For a sine half wave of 10 ms we achieved a non repetitive peak forward current capability of about 3700 A/cm2 which is about ten times rated current (for comparison: destructive current density of a standard Schottky diode ~ 1650 A/cm²). Additionally the device shows a stable avalanche and is able to withstand a single shot avalanche of 9.5 3s and 12.5 mJ.
Authors: Dietrich Stephani, Reinhold Schörner, Dethard Peters, Peter Friedrichs
Abstract: We have carefully investigated a number of more than 120 selected chips fabricated on one wafer, by I-V measurements at two different precisely controlled temperatures and precision CV measurements at room temperature. From these measurements the net-doping concentration, the C-V (flat-band) barrier ΦCV, the ideality n, the apparent Richardson constant Aapp and the apparent I-V barrier Φapp have been extracted for each chip. An extremely unique C-V barrier was determined showing a relative standard deviation (sigma over mean) of only 0.086%. Moreover, the average ideality n was found to be as low as 1.028 exhibiting a relative standard deviation of only 0.35%. A clear linear correlation (ρ2 = 0.968) between ideality n and apparent I-V barrier was observed. The effective Richardson constant A** of 4H-SiC in 〈0001〉 directions could therefore be extracted to be most likely in the interval 70 Acm-2K-2 < A** < 80 Acm-2K-2.
Authors: Dethard Peters, Bernd Thomas, T. Duetemeyer, T. Hunger, R. Sommer
Abstract: The paper describes first results of 6.5 kV SiC PiN diode modules which are designed as neutral point valves for medium-voltage power inverters rated for 1000 A. The power module consists of 4 AlN DCB substrates soldered on an AlSiC base plate. Each DCB is equipped with 20 SiC PiN diodes operating in parallel. The total active area of all 80 diode chips is 5.68 cm². At the rated current of 2 x 500A the forward voltage drops from 4.1 V at room temperature to 3.9 V at an averaged junction temperature of 125°C. The switching experiments show a very low reverse recovery charge of about 30 µC only. The conduction loss is comparable to the corresponding 6.5 kV silicon diode whereas the dynamic loss is marginal with respect to the forward conduction loss if the switching frequency is held below 10 kHz.
Authors: Jochen Hilsenbeck, Michael Treu, Roland Rupp, Dethard Peters, Rudolf Elpelt
Abstract: SiC Diodes in the 300 to 1200V range have steadily increased their market penetration in the last 7 years. Especially the 600V SiC diodes are a nearly mandatory device for further increase of power density in modern switch mode power supplies. Those devices entered the market from the high end side due to the still significant higher costs in comparison with conventional fast Si diodes. On the other hand, these high end markets like server or telecom power supplies also require very high reliability of the devices used. In previous papers we showed, that Merged-PN-Schottky (MPS) diodes can be designed for avalanche ruggedness [1,2]. In this paper we will describe, how this feature supports overall reliability improvement. Addditionally, we will show, how a conventional SiC Schottky diode without MPS structure can be modified in order to achieve stable avalanche breakdown in combination with strong reliability improvement.
Authors: Karl Otto Dohnke, Dethard Peters, Reinhold Schörner
Abstract: Silicon Carbide bipolar diodes offer unique ultrafast switching behavior for high voltage and high power applications [1]. But due to the small chip size it is required to parallel a lot of dice and therefore it is necessary to get detailed information about the electrical and thermal behavior of single diodes. For the characterization in the full current and voltage regime we have developed a molded leadframe package. The package was designed with a lateral contact geometry and a high creepage distance of 20 mm, which enable us to characterize these diodes for high voltage applications. Forward and reverse I-V characteristics and turn-off behavior under hard switching conditions up to 300 °C are reported. Additionally the forward voltage stability and power cycling tests are discussed.
Authors: Dethard Peters, Peter Friedrichs, Reinhold Schörner, Dietrich Stephani
Showing 1 to 10 of 25 Paper Titles