Papers by Author: Dong Hyeok Kim

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Authors: Ouk Sub Lee, Man Jae Hur, Yeon Chang Park, Dong Hyeok Kim
Abstract: The difference in the Coefficient of Thermal Expansion (CTE) between the chip and the substrate generate thermal displacement in the solder joint. It seems to be a main cause of failure in the solder joint when the chip and the substrate are heated repeatedly. The failure of the solder joints by thermal fatigue is known to be influenced by varying boundary conditions such as the difference in CTE, the height of solder, the Distance of the solder joint from the Neutral Point (DNP) and the temperature variation. In this paper, the effects of varying boundary conditions on the failure probability of the solder joint are studied by using the probabilistic approach methods such as the First Order Reliability Method (FORM) and the Second Order Reliability Method (SORM).
2593
Authors: Ouk Sub Lee, Dong Hyeok Kim
Abstract: The effects of varying distribution type of random variables and environmental, operational, and design random variables influenced by a shock wave caused from various origins on the failure probability are systematically investigated using the first order reliability method (FORM) for buried pipeline. It is found that the failure probability of the buried pipeline increases with faster P-wave velocity and slower S-wave velocity. The failure probability is estimated to be the largest for the Weibull distribution and the smallest for the lognormal distribution. A set of similar values of the failure probability for the normal distribution and lognormal distribution are noted. The normalized margin is defined and estimated. Furthermore, the normalized margin is used to predict the failure probability simply by using the fitting lines between the failure probability and the normalized margin.
1888
Authors: Ouk Sub Lee, Dong Hyeok Kim
Abstract: The reliability estimation of pipeline is performed in accordance with the probabilistic methods such as the FORM (first order reliability method) and the SORM (second order reliability method). A limit state function has been formulated with help of the FAD (failure assessment diagram). Various types of distribution of random variables are assumed to investigate its effect on the failure probability. It is noted that the failure probability increases with the increase of the dent depth, the operating pressure and the outside radius, and the decrease of the wall thickness. Furthermore it is found that the failure probability for the random variables having the Weibull distribution is larger than those of the normal and the lognormal distributions.
2561
Authors: Ouk Sub Lee, Dong Hyeok Kim
Abstract: In this paper, the FORM (first order reliability method) has been employed to estimate the probability of failure for the buried pipeline degraded by corrosion defects. The estimated results are used to assess the reliability of buried pipeline exposed to varying external and internal boundary conditions corresponding to a required target safety level. Furthermore, the effects of distribution types of random variables affecting the strength of buried pipelines on the probability of failure and the reliability of the buried pipeline are systematically investigated. The plant-engineers should be informed about the margin of safety level of existing pipelines corresponding to the target safety level to assess the integrity of the corroded pipeline under operation.
183
Authors: Ouk Sub Lee, Yong Hwan Han, Dong Hyeok Kim
Abstract: The Split Hopkinson Pressure Bar (SHPB) technique with some special experimental apparatus can be used to obtain the dynamic material behavior under high strain rate loading conditions. An experimental technique that modifies the conventional SHPB has been developed for measuring the compressive stress strain responses of materials with low mechanical impedance and low compressive strengths such as rubber. This paper uses PEEK (Poly-ether-ether-ketone plastic) bars to achieve a closer impedance match between the pressure bar and the specimen materials. In addition, a pulse shaper is utilized to lengthen the rise time of the incident pulse to ensure stress equilibrium and homogeneous deformation of the rubber specimen. It is confirmed that the modified technique is useful to record the dynamic deformation behavior of rubbers under various conditions such as high strain rate with various temperature effect. Furthermore, the dynamic deformation behaviors of heat-aged rubber material under compressive high strain rate are evaluated using the modified SHPB technique.
619
Authors: Ouk Sub Lee, Dong Hyeok Kim, No Hoon Myoung, Si Won Hwang
Abstract: Pipelines widely used for the transportation of varying fluids from one place to another should be maintained in good condition to avoid, if possible, the occurrence of corrosion in pipelines to keep its reliability in terms of fracture and damage. The reliability of buried pipelines with corrosion defects is estimated using the failure probability. The FORM (first order reliability method) is utilized to estimate the failure probability of buried pipeline with various formulas for external stress in pipe and three different corrosion models. In this paper, it is recognized that the failure probability increases not only with increasing exposure time, operating pressure and diameter of pipe but also with decreasing wall thickness and yield stress of pipe material in three different corrosion models. And the effects of the scattering of random variables regarding reliability of pipelines on failure probability are investigated, systematically. Furthermore, the target safety level is used to determine the level of safe of corroded pipeline and the effects of varying boundary conditions on target safety level are also estimated.
411
Authors: Ouk Sub Lee, Dong Hyeok Kim
Abstract: In this paper, the failure probability is estimated by using the FORM (first order reliability method), the SORM (second order reliability method) and the Monte Carlo simulation to evaluate the reliability of the corroded pipeline. It is found that the FORM technique is more effective in estimating the failure probability than the SORM technique for B31G and MB31G models with three different corrosion models. Furthermore, it is noted that the difference between the results of the FORM, the SORM and the Monte Carlo simulation decreases with the increase of the exposure time.
597
Authors: Ouk Sub Lee, Man Jae Hur, Jai Sug Hawong, No Hoon Myoung, Dong Hyeok Kim
Abstract: The differences in the coefficient of thermal expansion (CTE) between the chip and the FR-4 board generate the shear strains and the bending moment in the solder joint. It seems to be a main cause of failure in the solder joint when the chip and the FR-4 board are heated repeatedly. Thus, the fatigue loading induced by thermal cycling is a major concern in the reliability of the solder joint. The magnitude of shear strain and the final failure are known to be influenced by varying boundary conditions such as the difference of CTE, the height of solder, the distance of the solder joint from the neutral point (DNP) and the temperature variation. In this paper, the effects of boundary conditions on the failure probability of the solder joint are studied by using the failure probability models such as the First Order Reliability Method (FORM) and the Monte Carlo Simulation (MCS). Furthermore, the stiffness of the solder joint is considered to investigate the influence at the failure probability.
621
Authors: Ouk Sub Lee, No Hoon Myoung, Dong Hyeok Kim
Abstract: The differences of coefficient of thermal expansion (CTE) of component and FR-4 board connected by solder joint generally cause the dissimilarity in shear strain and failure in solder joint when they are heated. The first order Taylor series expansion of the limit state function (LSF) incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. Various thermal fatigue models, classified into five categories: categories four such as plastic strain-based, creep strain-based, energy-based, and damage-based except stress-based, are utilized in this study. The effects of random variables such as CTE, distance of the solder joint from neutral point (DNP), temperature variation and height of solder on the failure probability of the solder joint are systematically investigated by using a failure probability model with the first order reliability method (FORM) and thermal fatigue models.
1816
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