Papers by Author: Kevin P. Trumble

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Authors: Dinakar Sagapuram, Mert Efe, Wilfredo Moscoso, Srinivasan Chandrasekar, Kevin P. Trumble
Abstract: Deformation microstructure and texture in Mg-AZ31B bulk strips processed through extrusion-machining were studied as a function of deformation temperature. At warm deformation temperatures (~200°C), cold-worked type microstructures with predominant tilted basal texture were observed. With increase in temperature, grain structure sharply transformed into equiaxed type with predominant in-plane basal texture. This sharp transition was found to be consistent with change in temperature dependent dynamic recrystallization mechanism from continuous to discontinuous type.
Authors: Fu Hong Zhang, Kevin P. Trumble, Keith J. Bowman
Authors: Srinivasan Swaminathan, Srinivasan Chandrasekar, W. Dale Compton, Alexander H. King, Kevin P. Trumble
Authors: Hyun Jun Kim, Kevin P. Trumble, Keith J. Bowman
Abstract: Melt infiltration of preforms prepared by sequential centrifugal casting and by tape casting and lamination has been accomplished using a short-time infiltration process that significantly suppresses reaction product formation. For layered materials produced via infiltration of laminated ceramic tapes, of particular interest is the effect that a large change in microstructure has on infiltration, phase formation and mechanical properties.
Authors: Tejas G. Murthy, C. Huang, M. Ravi Shankar, Srinivasan Chandrasekar, Kevin P. Trumble, John P. Sullivan
Abstract: The temperature and strain rate fields in severe plastic deformation (SPD) are measured using infra-red thermography and Particle Image Velocimetry (PIV), respectively. Plane strain machining is used as the method of SPD to impose controlled strains and strain rates. For metals such as titanium, the temperature rise is small at small strain rates and SPD occurs at near-ambient temperature. The possibility of exploring dynamic recovery/recrystallization phenomena using the Zener-Hollomon parameter in this SPD framework is briefly discussed.
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