Papers by Author: M.M. Reddy

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Authors: D. Sujan, X.B. Pang, M.E. Rahman, M.M. Reddy
Abstract: Thermo-mechanical stresses have been considered one of the major concerns in electronic Packaging assembly structural failure. The interfacial stresses are often caused by the thermal mismatch stresses induced by the coefficient of thermal expansion (CTE) difference between materials, typically during the high temperature change in the bonding process. This research work examined the effect of bond layer on thermal mismatch interfacial stresses in a bi-layered assembly. The paper verified the existing thermal mismatch solder bonded bi-layered analytical model using finite element method (FEM) simulation. The parametric studies were carried out on the effect of change of bond layer properties in order to provide useful references for interfacial stress evaluation and the electronic packaging assembly design. These parameters included CTE, temperature, thickness, and stiffness (compliant and stiff bond) of the bond layer. The recent development on lead free bonding material was being reviewed and found to have enormous potential and key role to address the future electronic packaging assembly reliability.
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Authors: S.E.M. Chien, M.M. Reddy, V.C.C. Lee, D. Sujan
Abstract: The unique properties of Inconel 718 make it a challenging material to machine especially in ball end milling operations due to high cutting force and temperature concentrated at the cutting zone. These essentially lead to accelerated tool wear and failure resulting in high costs and loss of production. In this research, finite element numerical simulation was performed using AdvantEdge to simulate ball end milling using an 8mm TiAlN coated carbide tool. Response Surface Methodology (RSM) is applied by using a 3 level 3 factorial Box-Behnken design of experiment with different combinations of cutting speed, feed rate, and depth of cut parameters with a selected range of parameters to simulate finishing operations. Temperature contour from finite element analysis showed that the highest temperature occurs near the depth of cut line just before the chip separates from the workpiece. Using multiple linear regression, a quadratic polynomial model is developed for maximum cutting force and a linear polynomial model peak tool temperature response respectively. Analysis of Variance (ANOVA) showed that feed rate had the most significance for cutting force followed by depth of cut. Also, cutting speed was found to have little influence. For peak tool temperature, cutting speed was the most significant cutting parameter followed by feed rate and depth of cut.
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