Papers by Author: Soon Bok Lee

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Authors: Il Ho Kim, Tae Sang Park, Se Young Yang, Soon Bok Lee
Abstract: Fatigue behaviors of 63Sn37Pb and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling to solder joints than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluate the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder joint in BGA packages. The results revealed that lead free solder joints have a good fatigue property in the low temperature condition, where a small strain was induced. In the high temperature condition where a large strain was induced, however, lead contained solder joints have a longer fatigue life.
Authors: Keum Oh Lee, Seong Gu Hong, Soon Bok Lee
Abstract: Isothermal cyclic stress-strain deformation and thermomechanical deformation (TMD) of 429EM stainless steel were analyzed using a rheological model employing a bi-linear model. The proposed model was composed of three parameters: elastic modulus, yield stress and flow stress. Monotonic stress-strain curves at various temperatures were used to construct the model. The yield stress in the model was nearly same as 0.2% offset yield stress. Hardening relation factor, m, was proposed to relate cyclic hardening to kinematic hardening. Isothermal cyclic stress-strain deformation could be described well by the proposed model. The model was extended to describe TMD. The results revealed that the bi-linear thermomechanical model overestimates the experimental data under both in-phase and out-of-phase conditions in the temperature range of 350-500oC and it was due to the enhanced dynamic recovery effect.
Authors: J.H. Kim, K.W. Lee, D.C. Seo, Soon Bok Lee
Authors: Se Young Yang, Woon Seong Kwon, Soon Bok Lee, Kyoung Wook Paik
Abstract: The use of anisotropically conductive adhesives (ACA) for the direct interconnection of flipped silicon chips to printed circuits (flip chip packaging), offers numerous advantages such as reduced thickness, improved environmental compatibility, lowered assembly process temperature, increased metallization options, cut downed cost, and decreased equipment needs. Despite numerous benefits, ACA film type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. In this study, warpage of the chip is monitored by real time moiré interferometer during –50oC to +125oC temperature range. Moreover, reduction in chip warpage due to increase in delamination length is obtained as in function of thermal fatigue cycles. Finally, a new model to predict damage level of ACA package and remained life is proposed and developed.
Authors: Keum Oh Lee, Soon Bok Lee
Abstract: Gray cast iron shows large asymmetrical features by the graphite flake when tensile and compressive stresses are applied. The plastic strain rage which is used in low-cycle fatigue life prediction by many researchers is hardly defined and gives very different values by the Standards in this case. From the results of this study, it is not reliable to use the plastic strain range as a low-cycle fatigue damage parameter. Therefore, the plastic strain energy density which is uniquely defined was suggested as a damage parameter and it showed good correlation in low-cycle fatigue in gray cast iron.
Authors: Seong Gu Hong, Soon Bok Lee
Abstract: Low cycle fatigue (LCF) tests were carried out in a wide temperature range (20°C-650°C)at strain rates of 1×10-4/s-1×10-2/s for 17% cold worked (CW) 316L stainless steel to investigate the conditions for the occurrence of dynamic strain aging (DSA) and its effects on material properties during LCF deformation. DSA introduced anomalous changes of LCF properties, and the DSA regime under LCF loading condition coincided with that in tensile loading condition. During LCF deformation, dynamic stain aging can be manifested in the forms of the occurrence of the plateau or the peak in the variation of cyclic peak stress with temperature, the negative temperature dependence of plastic strain amplitude or softening ratio, the negative strain rate sensitivity, and the negative strain rate dependence of plastic strain amplitude or softening ratio.
Authors: Jin Hyoung Park, Chang Kyu Chung, Kyoung Wook Paik, Soon Bok Lee
Abstract: Among many factors that influence the reliability of a flip-chip assembly using NCF interconnections, the most effective parameters are often the coefficient of thermal expansion (CTE), the modulus (E), and the glass transition temperatures (Tg). Of these factors, the effect of Tg on thermal deformation and device reliability is significant; however, it has not been shown clearly what effect Tg has on the reliability of NCF. The Tg of a conventional NCF material is approximately 110°C. In this study, a new high Tg NCF material that has a 140oC Tg is proposed. The thermal behaviors of the conventional and new NCFs between -40oC to 150oC are observed using an optical method. Twyman-Green interferometry and the moiré interferometry method are used to measure the thermal micro-deformations. The Twyman-Green interferometry measurement technique is applied to verify the stress-free state. The stress-free temperatures of the conventional and new Tg NCF materials are approximately 100oC and 120oC respectively. A shear strain at a part of the NCF chip edge is measured by moiré interferometry. Additionally, a method to accurately measure the residual warpage and shear strain at room temperature is proposed. Through the analysis of the relationship between the warpage and the shear strain, the effect of the high-Tg NCF material on the reliability is studied.
Authors: Tae Kyung Hwang, Soon Bok Lee
Abstract: The leading candidates for replacing lead-contained solders are near ternary eutectic Sn/Ag/Cu alloys. The electronic industry has begun to study both the process behavior and the reliability assessment of these alloys in detail to figure out their applicability to electronic devices and products. In recent publications, the solidification behavior and the fatigue life of the accelerated thermal cycle test have been reported in terms of microstructure variations such as the formation of large Ag3Sn plates and their effects. In this study, coupon type bulk specimens have been made for uniaxial tensile test by casting. To consider the effects of microstructure, casting cooling rates were controlled to 0.02-2.0 oC/sec. Eutectic Sn/Pb and near eutectic lead-free solder materials – Sn/Ag/Cu and Sn/Cu alloys – were used in mechanical testing. Also, nanoindentation tests were performed to measure Young’s modulus of materials having different microstructures. Tensile tests were performed at 3 different strain rates and then acquired 0.2% offset proof stress, ultimate tensile strength and elongation to failure.
Authors: Seong Gu Hong, Keum Oh Lee, Jae Yong Lim, Soon Bok Lee
Abstract: Low-cycle fatigue tests were carried out in air in a wide temperature range from room temperature to 650oC to investigate the role of temperature on the low-cycle fatigue behavior of two types of stainless steels, cold-worked (CW) 316L austenitic stainless steel and 429 EM ferritic stainless steel. CW 316L stainless steel underwent additional hardening at room temperature and in 250-600oC: plasticity-induced martensite transformation at room temperature and dynamic strain aging in 250-600oC. As for 429 EM stainless steel, it underwent remarkable hardening in 200-400oC due to dynamic strain aging, resulting in a continuous increase in cyclic peak stress until failure. Three fatigue parameters, such as stress amplitude, plastic strain amplitude and plastic strain energy density, were evaluated. The results revealed that plastic strain energy density is nearly invariant through a whole life and, thus, recommended as a proper fatigue parameter for cyclically non-stabilized materials.
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