Papers by Author: Takeshi Tanaka

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Authors: Takeshi Tanaka
Abstract: In this study, we proposed ER fluid-aided polisher (ERAP) using one-sided, patterned electrodes. The characteristics of ER fluid and ER fluid containing abrasive grit were investigated. The polishing performances of ER fluid containing abrasive grit were verified using an ERAP. The following conclusions were obtained. Thick clusters formed between both electrodes with increased voltage. Abrasive grit was condensed on the thick clusters of ER fluid-particles that formed around the electrodes with further increases in voltage. The ER effect is a hardening of ER fluid under loading by an electric field. The ER effect of ER fluid containing abrasive grit decreased because the grit clusters bound weakly to each other. The ER effect decreased with a decrease of grit size. The surface roughness showed little change when a Shower curtain (a nylon cloth) was used for a pad. An electric field was generated around the cutting zone when a Toraysee (a washable lens cloth) was used as a pad. This leads to large efficiency and high precision in polishing. The surface roughness decreased with increased voltage up to 1.0kV/mm, because the abrasive grit was tightly fixed by the ER effect. A minimum surface roughness was attained at approximately 1.0 kV/mm when using WA and SD grits. The surface roughness increased due to a hardening of the ER fluid, causing deep scratching of the workpiece at 2.0kV/mm.
201
Authors: Takeshi Tanaka, S. Esaki, K. Nishida, T. Nakajima, K. Ueno
251
Authors: S. Maeda, Takeshi Tanaka, M. Koiwa
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Authors: Takeshi Tanaka
Abstract: The purpose of this study is to fabricate a wheel using fullerenes with nano-scaled particles, and to investigate the polishing performance of fullerene wheel. A super smooth surface was formed on a silicon wafer by polishing the wafer with metal-bonded diamond wheels using a diamond abrasive grit of 0-0.125 μm and fullerenes with a diameter of 0.7 nm. We used two kinds of metal-bonded diamond wheels for pre-polishing and a metal-bonded fullerene wheel for the finishing process. Though the surface roughness after polishing with the fullerene wheel was almost equal to that obtained by polishing with the metal-bonded diamond wheel using diamond abrasive grit of 0-0.125 μm, the chemical-mechanical polishing process was clarified by AFM (atomic force microscope) observation when we used a metal-bonded fullerene wheel with 5wt% KOH (potassium hydroxide) solution. The greater number of smoothed portions on the surface of the silicon wafer indicated that the fullerenes provided the same polishing ability as that of the abrasive grit.
61
Authors: Y. Chiwaya, Takeshi Tanaka
Abstract: When a light-excitation substance such as a high polymer absorbs the light energy of an ultraviolet ray, it will be excited. If this substance reacts with the processing material in an atomic order under the excited conditions, it may be available for use in fine processing. Thus, it appears that the processing in a sub-nanometer order may be realized by a phenomenon called luminescence. The following merits can be considered: 1) little reaction heat, 2) little heat influence on the processed material, 3) easy reaction control in comparison with chemical processing. In this research, the processing principle was verified by dipping the processing material for a fixed time in pure water mixed the fluorescent substance exposed to an ultraviolet ray. The surface of copper that had been precisely lapped was used in the experiment. The abrasion of its surface was observed by AFM. Based on the results of these basic experiments, an ultraviolet-ray irradiation type polisher was manufactured for use in the polishing experiment of copper. This paper describes the polishing characteristics of copper exposed to an ultraviolet ray.
343
Authors: Takeshi Tanaka, Saburo Nasu, Keiyu Nakagawa, Keiichi N. Ishihara, Paul Hideo Shingu
269
Authors: Saburo Nasu, S. Imaoka, S. Morimoto, H. Tanimoto, B. Huang, Takeshi Tanaka, J. Kuyama, Keiichi N. Ishihara, Paul Hideo Shingu
569
Authors: Takeshi Tanaka
Abstract: A fundamental study on finishing aided by an ultraviolet ray (generally mashining:referred to as U-RAMR) was conducted to evaluate its applicability to the polishing of aluminum alloy. Qualitative analysis with X-ray photoelectron spectroscopy (XPS) was used to estimate the chemical reaction induced on Al surfaces that were immersed in some solutions. Inductively coupled plasma spectroscopy (ICPS) was employed to quantitatively analyze the amount of oxidized/dissolved Al, Mg and Fe. The following conclusions were obtained by investigation of the aluminum alloy polishing process. Aluminum does not dissolve in TiO2-solution, whereas a small amount of Al dissolves into cathilon dye solution. Although only a small amount of Al dissolves in TiO2-cathilon dye solution in the absence of UV irradiation, the amount of Al dissolved increases slightly under UV irradiation with the formation of oxide, nitrogen oxide and nitride on the Al surface. In addition, a small amount of an aluminum chloride dissolves into TiO2-cathilon dye solution. An Al alloy (A5052) surface was made flat by polishing with TiO2-cathilon dye slurry under UV irradiation.
321
Authors: Takeshi Tanaka
Abstract: This study targets the development of a polishing technique that uses a photocatalyst and a fluorescent substance excited by an ultraviolet ray. Nickel (hereafter referred to as Ni) was polished chemically and mechanically at the micrometer level under ultraviolet-ray irradiation. Measurements clarified that TiO2 of 0.1-μm grain size, at which size the excitation by the ultraviolet ray was less influential, mechanically polished the Ni. Cathilon (a luminous dye) chemically polishes Ni. The corrosion of the Ni surface became large under ultraviolet-ray excitation. A flat surface was attained on the Ni by chemical and mechanical polishing using both the TiO2 and cathilon, when was irradiated by an ultraviolet ray.
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