Papers by Author: Wei Peng

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Authors: Fan Xiao, Wei Peng, Jian Hua Yao, Hao Ni
Abstract: This article discusses the influence factors of bilingual teaching effect by bilingual teaching practice of the Advanced Manufacturing Technology, and proposes solutions. Practice shows that the reform of teaching idea is the prerequisite for the effective bilingual teaching, and PBL teaching model is the effect ways to improve the effects of bilingual teaching.
Authors: Wei Peng, Fan Xiao, Lu Fang Zhang, Yan Zhan
Abstract: China's English education has acted as a huge and persistent system. But still it can not solve the problem that graduates can not use English well in their professions. In this paper, based on the project of bilingual teaching reform of "Advanced Manufacturing Technology", it is presented that the bilingual teaching for senior in university should act as a final ring in the foreign language education chain in China. In this final ring, both the teaching philosophy that English is only a kind of tool and the teaching strategy of using English are two crucial factors. The teaching result shows that the bilingual teaching played a multiplier effect in achieving the ultimate goal of English education.
Authors: Wei Peng, Chun Yan Yao, Xue Feng Xu
Abstract: A novel technology is studied in this paper to make photosensitive resin grinding wheel based on layered manufacturing technology. The bond strength among resin layers is analyzed. An effective measure is proposed to improve the bond strength among resin layers of the grinding wheel. We add magnetic abrasive particles into the liquid resin to get rough surface and increase contact area by action of magnetic force. Some experiments are curried out for testing shear strength of resin with magnetic abrasive under different conditions. Results show that this method had a significant effect in improving the bond strength among layers of new grinding wheel.
Authors: Wei Peng, W. Huang, Xue Feng Xu
Authors: S.Y. Wang, Bo Lin Cheng, Can Wang, Wei Peng, S.Y. Dai, Zhao Hui Chen
Abstract: In this work, BST (x=0.7, 0.5, 0.3) films have been deposited onto Nb-SrTiO3 substrate with pulsed laser deposition. The crystal structure and surface morphology have been characterized by X-ray diffraction (XRD) and atomic force microscopy, respectively. XRD results revealed that in certain elaboration condition the films were aligned along (00l) direction, normal to the substrate surface. The dielectric loss, relative dielectric permitivity, and polarization of BST films strongly depended on Sr content at room temperature. The tunability of relative dielectric permitivity of BST films exhibited strongly dependence on Sr content, and BST-0.5 shows the maximun K (K = tunability/loss) value.
Authors: Ming Huan Wang, C.Y. Yao, Qiao Fang Zhang, Wei Peng
Abstract: Electrochemical machining (ECM) technology has the advantage of machining the workpiece with complex profile on the basis of electrolysis. In this study, turbulated holes with the rib’s shape of spiral and annular were processed by ECM by using the shaped cathodes. Experimental system was built which consists of electrolyte supply module, power supply unit and workpiece holding device. Machining experimentations were carried out on the built system. Analysis and discussions were done according to the experimental results. It indicated machining efficiency is high by using the shaped cathode. Machining error could be controlled within 10-20%.
Authors: Wei Peng, C.Y. Yao, Xun Lv, F.Q. Liu, Tao Gao, Ju Long Yuan
Abstract: This paper describes a method for experimental development of a novel fixed abrasive nano-grinding plate (FAG-plate) which is proposed for lapping some rigid brittle materials, such as quartz crystal and silicon. The FAG plate is developed with ultraviolet-cured resin by rapid prototyping technology. The analysis shows that such FAG-plate can keep its grinding ability constant and continuous and it can make the roughness of machined surface reach to nanometer level. Based on experimental comparisons with conventional free abrasive slurry lapping plates, the lapping process using FAG-plate has several distinct advantages. One is that the machining efficiency is significantly improved. The second is that it improves the surface roughness of machined work-pieces, although it decreases the flatness tolerance of materials. Furthermore, the fixed abrasive nano-grinding plate is made by the new bonding materials- ultraviolet curing resin and thus the fabrication of FAG-plate is convenient and economical.
Authors: Xue Feng Xu, H.T. Ma, B.X. Ma, Wei Peng
Abstract: In order to increase the material removal rate of silicon wafer, composite abrasives slurry was used in CMP. The mechanism of interaction between silica abrasives and polymer particles was analyzed. Small silica abrasives were seen to attach onto the surface of the polymer particles. Composite abrasives slurry was obtained by adding polymer particles into single abrasive slurry. Three key parameters, the concentration of colloidal silica, the concentration of polymer particle and the speed of polishing, which influence the material removal rate of silicon wafer were analyzed by Taguchi method and the optimal parameters were obtained. Experimental results indicated that the maximum material removed rate of 353nm/min was obtained when optimal craft parameters of 5% colloidal silica, 3% polymer particle, 50rpm plate and carrier rotation speed were selected.
Authors: Chun Yan Yao, Zong Hua Xu, Wei Zhang, Qiao Fang Zhang, Wei Peng
Abstract: Heat generated during wire saw slicing can cause silicon temperature raise and make silicon wafer warpage, especially for larger silicon wafers. In order to study the wire saw effect on silicon temperature during slicing process, three kinds of wire saw, mainly semi-fixed abrasive wire saw and traditional wire saw, are applied for slicing silicon ingot. In this paper, the thermocouple is used to measure the temperature of the silicon during wire saw slicing. The experiment results show that the temperature of the silicon increases along with the wire saw working direction and reaches maximum value near the outlet position of silicon. The temperature of the silicon sliced by semi-fixed abrasive wire saw is lower than that sliced by traditional wire saw.
Authors: Zhi Wei He, Ming Huan Wang, Li Zhang, Wei Peng
Abstract: A method of fabricating convex plate-shaped micro electrode was proposed based on the electrochemical etching principle. The square sectional electrodes were prepared in advanced using wire-EDM, The micro cylindrical electrode was fabricated firstly by using the eletrochechemical etching method. Then the top end was insulated to protect it from etching. Then the convex plate-shaped micro electrode was obtained in subsequent etching. Comparative experiments in drilling micro-hole in stainless steel with the thickness of 1mm were done by using the cylindrical and convex plate-shaped micro electrode. Results shows that the better locality, smaller side-gap and hole taper could be obtain by using convex plate-shaped micro electrode.
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