Papers by Author: Wolfgang Bartsch

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Authors: Dethard Peters, Wolfgang Bartsch, Bernd Thomas, R. Sommer
Abstract: The paper compares static and dynamic characteristics of 6.5 kV SiC PiN diodes fabricated with different p-emitters. The version with the thickest p-emitter (4 µm) showed the lowest forward voltage (3.4 V at 100 A/cm²) and the lowest (negative) temperature coefficient. Forward voltage DC stress tests revealed a stability within the measurement error of the test apparatus (<50 mV). The dynamic performance showed a soft recovery even at 4 kV. The reverse recovery charge Qrr is analyzed for different forward currents and junction temperatures. The dynamic losses of the SiC PiN diode are marginal with view to the application in industrial inverters.
Authors: Karl Otto Dohnke, Wolfgang Bartsch, Reinhold Schörner, T. Van Weelden
Abstract: We present first results on power cycling of 6.5 kV SiC PiN-diodes mounted into a molded package. The geometry of this lateral package was designed to fulfill the specifications of the electrical isolation and the creepage distances in the high voltage region of 6.5 kV. To evaluate the suitability of this package we used high voltage SiC PiN-diodes. The diodes were soldered onto a copper lead frame, wire bonded and covered by molding compound. The packaged diodes were characterized by electrical measurements before and during a power cycling test with a temperature swing of 90 K. These results showed long term stable behavior of the I-V characteristics of the diodes as well as the suitability of the package for high temperature and high voltage application of SiC devices.
Authors: Wolfgang Bartsch, Heinz Mitlehner, S. Gediga
Abstract: In this contribution we summarize measurements on bipolar high voltage SiC-diodes which were fabricated on 4H-SiC wafers preferentially cut 4° off the [0001] basal plane, whereas the p-emitter thickness was varied in predetermined ratios to the n-base thickness. The switching behaviour of optimized 6.5 kV-Diodes at a current level of 25 A is shown at DC link voltages up to 4 kV and at a junction temperature of 125°C. Experimental results are discussed in terms of snappiness.
Authors: Sergey A. Reshanov, Wolfgang Bartsch, Bernd Zippelius, Gerhard Pensl
Abstract: Lifetime measurements are performed on 4H-SiC pin power diodes (6.5 kV). The lifetime values in the base range from 1.1 s to 2.1 s; these values demonstrate the high quality of the 4H-SiC epilayer and the optimized device processing. The observed lifetimes are correlated with deep defect centers detected by deep level transient spectroscopy. The role of the Z1/2-center as a lifetime killer is discussed.
Authors: Sandra Heim, Andreas Albrecht, Wolfgang Bartsch
Abstract: In this work we discuss a structure of a p-doped Poly-Si layer and a Ni layer deposited onto n-type 4H-SiC in order to form a Schottky-like contact which undergoes a specific temperature budget to establish a temperature independent forward characteristic of the formed rectifying junction. The results of our treatment is discussed in terms of a hetero junction, though temperature treated NiSi-layers normally are expected to show an ohmic behavior.
Authors: Wolfgang Bartsch, Reinhold Schörner, Karl Otto Dohnke
Abstract: In this work we discuss measurements of the breakdown voltage of diodes with non-punch-through (NPT)- and punch-through (PT)-designs. From the experimental results we deduce the temperature dependent Fulop constants of the effective ionization rate. The data of this work agree very well with ionization rates for electrons and holes determined recently.
Authors: Roland Rupp, Michael Treu, Anton Mauder, Erich Griebl, Wolfgang Werner, Wolfgang Bartsch, Dietrich Stephani
Authors: Bernd Thomas, Wolfgang Bartsch, René A. Stein, Reinhold Schörner, Dietrich Stephani
Authors: Peter Friedrichs, Heinz Mitlehner, Rainer Kaltschmidt, Ulrich Weinert, Wolfgang Bartsch, Christian Hecht, Karl Otto Dohnke, Benno Weis, Dietrich Stephani
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