Papers by Author: Armin Dadgar

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Authors: Aurangzeb Khan, Umar S. Qurashi, N. Zafar, M. Zafar Iqbal, Armin Dadgar, D. Bimberg
843
Authors: M. Zafar Iqbal, A. Majid, Armin Dadgar, D. Bimberg
Abstract: Deep-level defects related with 5d transition metal, osmium (Os) have been studied in ntype GaAs. Os has been incorporated in epitaxial n-GaAs layers in situ, during growth by lowpressure metal-organic chemical vapour phase epitaxy (MOVPE) technique. Mesa p+nn+ junction diodes are fabricated for investigations by deep level transient spectroscopy (DLTS). Two deeplevel peaks, observed in majority carrier (electron) emission spectra, Os1 and Os2, show a significant shift in peak positions to lower temperatures with the applied junction reverse bias, demonstrating enhancement of the thermal emission rate by the junction electric field. Doublecorrelation DLTS (DDLTS) measurements have been employed for accurate quantitative investigations of the observed field dependence. However, in view of the relatively small concentration of the deep level Os1, this technique is found to yield reliable data only for the deep level corresponding to the dominant peak, Os2. Detailed data have been obtained on the field effect for Os2, extending over junction electric field values 3 x 106 V/m - 1.2 x 107 V/m. The measured emission rate signatures show a reduction of the thermal activation energy from 0.48 eV to 0.21 eV for Os2 over this electric field range. Analysis of the data in terms of the recent theoretical work on field dependence indicates that Os2 is associated with a substitutional Os donor.
73
Authors: A. Krost, Armin Dadgar, F. Schulze, R. Clos, K. Haberland, T. Zettler
Abstract: Due to the lack of GaN wafers, so far, group-III nitrides are mostly grown on sapphire or SiC substrates. Silicon offers an attractive alternative because of its low cost, large wafer area, and physical benefits such as the possibility of chemical etching, lower hardness, good thermal conductivity, and electrical conducting or isolating for light emitting devices or transistor structures, respectively. However, for a long time, a technological breakthrough of GaN-on-silicon has been thought to be impossible because of the cracking problem originating in the huge difference of the thermal expansion coefficients between GaN and silicon which leads to tensile strain and cracking of the layers when cooling down. However, in recent years, several approaches to prevent cracking and wafer bowing have been successfully applied. Nowadays, device-relevant thicknesses of crackfree group-III-nitrides can be grown on silicon. To reach this goal the most important issues were the identification of the physical origin of strains and its engineering by means of in situ monitoring during metalorganic vapor phase epitaxy.
1051
Authors: F. Bertram, Daniel Forster, J. Christen, N. Oleynik, Armin Dadgar, A. Krost
Abstract: The surface morphology of the ZnO layers is dominated by a distinct hexagonal domain structure. While the laterally integrated cathodoluminescence spectrum shows intense and narrow I8 luminescence, a distinct emission line at spectral position of I0/I1 emerges in the local spectra taken at domain boundaries. In contrast, no I0/I1 emission is found inside the domains. Monochromatic images further evidence the selective incorporation of impurities at the grain boundaries of domains. Monochromatic images of the I8 peak wavelength directly visualize the strain relaxation across the domains towards their very center, where a drop in quantum efficiency indicates enhanced defect concentration.
1065
Authors: Shazia Parveen, Aurangzeb Khan, Umar S. Qurashi, N. Zafar, M. Zafar Iqbal, L. Köhne, Armin Dadgar, D. Bimberg
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