Papers by Author: Chun Lin Lu

Paper TitlePage

Authors: Meng Kao Yeh, Chun Lin Lu

Abstract: The thermal expansion mismatch problem for a chip due to temperature decrease from processing temperature to room temperature may cause...

563
Authors: Meng Kao Yeh, Chun Lin Lu

Abstract: The thermal stress and thermal fatigue life for three different microgyroscope chip models were investigated in this paper. The deformation...

622
Showing 1 to 2 of 2 Paper Titles