Papers by Author: Jae Ho Lee

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Authors: Yoo Min Ahn, Yong Jun Ko, Hyun Joon Kim, Dong Ho Lee, Su Kei Lee, Jae Ho Lee
Abstract: This paper discusses the effect of plating condition on the mechanical properties and residual stress of electroplated Cu film. The inlaid copper structure was fabricated on silicon wafer where silicon oxide was thermally grown. Seed layer was deposited by sputtering method followed by copper electro-deposition. Copper was electrodeposited with IBM paddle type electroplating machine Residual stress, hardness, elastic modulus, and surface roughness of electroplated copper film were investigated at various organic additives in plating solution and current types with a nanoindenter and a surface profilometer. The dishing amounts in chemical mechanical polishing (CMP) was also investigated at various additives. The results show that, in the case of residual stress, the copper film deposited at higher additive or PC current result in lower residual stress. The additives do not significantly affect the mechanical properties of Cu deposit.
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Authors: Dae Geun Kim, Jae Ho Lee
Abstract: The codeposition of fine WC and Co coated WC particles from nickel Watt’s bath has been investigated. Electroplating of Ni/WC and Ni/WC(Co) composites coating were carried out at different current density with variation of particle size. The effect of hydrodynamic conditions of the codeposition of Ni/WC bath has been investigated. The Guglielmi adsorption mechanism is applied to the electroplating of the fine WC and WC(Co) in Ni matrix. The adsorption rate of determination step is controlled by the transferal process of loose adsorption to strong adsorption. The embedded WC concentration can be increased both by increasing electrical current density and additional WC concentration in the bath.
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