Papers by Author: Jean François Silvain

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Authors: Jean François Silvain, Valérie Denis-Lutard, Pierre Marie Geffroy, Jean Marc Heintz
Abstract: Today, there is a strong push to improve the thermal management of electronic components in order to increase the performance and the reliability of electronic devices. Up to now, most of the heat sinks are mainly made of Copper that presents a good thermal conductivity (TC) but a coefficient of thermal expansion (CTE) much higher than the ceramic of the DBC (direct bonding Copper). It induces interfacial thermal stresses and indeed it decreases the reliability of the global electronic system. Therefore, there is a strong need for the development of novel heat dissipation material having low CTE combined with high TC. Carbon fibres reinforced copper matrix offers a good compromise between thermo mechanical properties (i.e. CTE) and medium TC. In order to increase surface TC, pure Copper can be added on the top surface and/or on the bottom one of the composite heat sink playing the role of heat spreader for hot spots linked with the Si components. The fabrication technique of these materials is based on powder metallurgy technique. The thermal properties of adaptive materials, TC and CTE, have been measured for different Copper thicknesses and architectures ([C/Cu], [Cu – C/Cu] and [Cu – C/Cu – Cu]). Simulation of the TC and CTE have been performed and compared to the experimental results.
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Authors: Y. Le Petitcorps, J.M. Poueylaud, L. Albingre, B. Berdeu, P. Lobstein, Jean François Silvain
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Authors: Pierre Marie Geffroy, Jean François Silvain, Thierry Chartier
Abstract: During the last decade, the use of metal matrix composites (MMCs) materials such as Al/SiC or CuW for microelectronic devices have made powder modules more reliable. Today, due to the continuous increasing complexity, miniaturization and high density of components in modern devices, high power microelectronic industries are looking for new adaptive thin films with high thermal conductivity, low coefficient thermal expansion, and good machinability. This paper presents an original and new elaboration method (tape casting and hot rolling) which has been optimized in order to elaborate copper/silicon carbide thin film composite materials. The first part presents the optimization of the tape casting parameters used (powder mixing; optimization of the nature and concentration of organic additives; tape casting, debinding and pre-sintering conditions). In the second part, the main characteristics of thin film obtained are discussed, such as thermomechanical properties of the composite Cu/SiC thin films.
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Authors: Jean François Silvain, P. Richard, Joël Douin, M. Lahaye, Jean Marc Heintz
Abstract: A study of the different stages of the electroless deposition of copper on carbon nano fibers activated firstly by a chemical treatment of the carbon nano fiber and secondly by a two-step method has been performed from both a chemical and a morphological point of view. The combination of XPS measurements and scanning electron microscopy imaging has allowed optimizing the 2 different stage conditions. On a first hand, the different oxide concentration and treatment time of the carbon nano fibers and on a second hand the different conditions of the sensibilisation (Sn bath), activation (Pd bath) and coating (Cu bath) have ben studied. The control of the homogeneity and thickness of copper thin films on carbon nano fiber can be obtained and further more sintered in order to obtain fully dense materials.
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Authors: Jean Marc Heintz, J.C. Bihr, Jean François Silvain
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Authors: Jean François Silvain, C. Binot, E. Durand, A. Demourgues
Abstract: NiTi shape memory alloy particles have been incorporated inside SnAgCu lead free solder paste in order to improve the mechanical performances of solder paste. However, because of the non-wetting properties of solid NiTi particles by the liquid SnAgCu matrix, the development of fluorine gas treatment of both NiTi and SnAgCu particles has been optimized. Scanning electron microscopy (SEM) micrographs of NiTi/SnAgCu composite materials have shown that “Fluorine treatment” of SnAgCu powders lead to a huge increase of the NiTi powder content inside the liquid SnAgCu matrix where no effect have been observed when NiTi materials are fluorinated. Xray photoelectron spectroscopy analysis of treated SnAgCu powders have been used in order to analyze surface chemistry evolution where wavelength dispersion spectroscopy line profiles, across NiTi-SnAgCu interfaces, have been performed.
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Authors: Pierre Marie Geffroy, Jean François Silvain
Abstract: In order to obtain materials for electronic applications that exhibit both excellent thermal conductivity and low coefficient of thermal expansion (CTE), copper matrix composites have been reinforced by short high modulus graphite fibers. The lack of fiber/matrix interaction prevents any degradation of the carbon reinforcement during the elaboration steps and the normal use of these materials. Elaboration conditions, such as mixing conditions of the short carbon fibers and the copper powder, dimension and shape of the two powders, and finally densification atmosphere, temperature, pressure and time, have been optimized. Main parameters involved in the thermal properties of the Cu/C composite materials have been analyzed and adjusted. CTE is mainly related with the carbon volume fraction; CTE ranging from 9 to 13 10-6/°C can be reproductively obtained with carbon volume fraction ranging from 50% to 20%. Thermal conductivity properties are more complex and are linked mainly with 1) the porosity level inside the material, and 2) the orientation, properties and volume fraction of the carbon fibers. For short carbon fibers, in plane thermal conductivity ranging from 200 to 550 W/mK have been reproductively measured associated with thermal conductivity through-thickness ranging from 150 to 300 W/mK.
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