Papers by Author: K. Kaminishi

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Authors: T. Kumazawa, K. Kaminishi
Abstract: Deformation measurements with a thermocouple were applied in a deformation test of solder joints. The thermocouple is effectively combined with a conventional testing machine. The lead–solder and non–lead solder joints were pulled and sheared. The load-displacement and electromotive force (Emf)–displacement curves can be continuously derived from the signals of a load cell and the thermocouple. The Emfs in tension were compared with that in shear. The maximum Emf value in tension was larger than the emf value in shear, which meant in weakness of the solder joint in shear. Fracture occurred at the interface between the copper layer pad and solder, and the obtained Emf is closely related to fracture at the interface. The maximum Emf value in the non-lead solder was smaller than the Emf value in the lead–solder.
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Authors: M. Agus Choiron, Shigeyuki Haruyama, K. Kaminishi
Abstract: The relationship of contact width and leakage had been found as design concept to optimize new metal gasket. By using this design concept, the limits of contact width for no leakage can be chosen. The optimize gasket shape can be developed by increasing of contact width. In this study, a gasket shape was optimized based on contact width as design concept and involving contact stress consideration. The design of experimentation (DOE) Taguchi method is used to analyses the effect of each parameter design and predict optimal design of new 25A metal gasket. The L18 orthogonal array was concerned to design experimental matrix for seven factors with three levels. The optimum design of gasket at 0 MPa mode is the model with OH = 4 mm, p1 = 3.5 mm, p2 = 4 mm, p3 = 4 mm, t = 1.2 mm, R = 3.5 mm and h = 0.4 mm. The optimum design of gasket at 400 MPa mode is the model with OH = 3 mm, p1 = 3.5 mm, p2 = 4.5 mm, p3 = 4.5 mm, t = 1.8 mm, R = 1.5 mm and h = 0.3 mm.
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