Papers by Author: Rong Shun Chen

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Authors: Tung Wei Lin, Max Ti Kuang Hou, Rong Shun Chen
Abstract: Utilizing suspended gate field-effect transistors (SGFETs), a displacement sensing mechanism is proposed in this paper. The design, numerical simulations, and fabrication process of the SGFET are presented. The SGFET arrays and the comb-drive actuator are integrated to form a MEMS position encoder. The resolution of the proposed MEMS position encoder is 6 μm over a 54 μm travel range. By arranging the SGFETs into arrays, position feedback over a large travel range is achieved for a comb-drive actuator.
1379
Authors: Cho Chun Wu, Rong Shun Chen, Meng Ju Lin
Abstract: There are two kinds of microsprings often used: box microsprings and zig-zag (serpentine) microsprings. Box microsprings are considered with larger spring constant k and more symmetric structure keeping balance than zig-zag microspring. Density of spring number, N, is defined as the numbers of turns within a constant total spring length to investigate performance of box microspring. With applying the same force, the relation between spring constants and microspring sizes are discussed. Under different size parameters of box microsprings: B, W, T, and L, the spring constants decrease like exponential decay and approach a limit value as density of spring number increasing. The results show density of spring number has significant effect on spring constant. Rate of change on spring constant, Kt, is defined as the ratio of spring constant between N=1 and N=10. It means normalization of spring constant that increase density of spring number from minimum to maximum. The results show Kt decreases when B and W increase and increase as T and L increasing. Therefore, the spring constant is coupled affected by different size parameters due to different tendency as results shown. Such that the results can apply in microspring design by adjusting these size parameters to obtain the spring constant.
975
Authors: Meng Ju Lin, Rong Shun Chen
Abstract: During depositing a thin film as a structure layer, residual stress from thermal treatment of depositing process will cause deformation after release. Thus the yield ratio and deformation of the devices may be lowered. This work investigates the effect of sacrificial layer on deformation by residual stress causing when depositing a thin film as structure layer. A model is established by using theory of plates-and-shells to investigate the deformation caused by residual stress when the structure layers of the devices are center-anchored circular plate. Theoretically, it is found that the deformation would happen when depositing structure layer under higher temperature. And from the analysis, the thicker structure plate will cause less deformation. When the thickness of the structure layer is larger than 3μm , the maximum deformation will reduce to the order of μm. Furthermore, four cases of different sacrificial layer types and temperature distribution with effect on deformation are discussed. If the thickness of the structure layer is above 5μm, the deformation caused by residual stress is not so important. And it is found that if the thickness of structure layer is 10μm order or above, the residual stress effect on deformation can be neglected. It is found the sacrificial layer will affect the deformation. But it is found that with the same structure layer thickness, as the sacrificial layer thickness increasing, the four cases have different effect on deformation. The in-plane dimension effect is also considered. When the in-plane dimension of sacrificial layer is above 20 times of outer radius, the in-plane dimension effect is neglected and can considered as an infinite dimension.
109
Authors: Chieh Tang Chuang, Rong Shun Chen
Abstract: This paper presents a high sensitivity micro capacitive tactile sensor that can detect normal forces which is fabricated using deep reactive ion etching (DRIE) bulk silicon micromachining. The tactile sensor consists of a force transmission plate, a symmetric suspension system, and comb electrodes. The sensing character is based on the changes of capacitance between coplanar sense electrodes and it can reach the aim of large sensing range. High sensitivity is achieved by using the high aspect ratio comb electrodes with narrow comb gaps and large overlap areas. In this paper, the sensor structure is designed, the capacitance variation of the proposed device is analyzed, and the finite element analysis of mechanical behavior of the structures is performed.
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