Papers by Keyword: Copper (Cu)

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Authors: Yoshitake Nishi, Kazunori Tanaka
185
Authors: Zs. Tôkei, Dezső L. Beke, Jean Bernardini, Andree Rolland
129
Authors: Yuan Shi Li, Yan Niu, F. Gesmundo
117
Authors: Jian Xiu Su, Yin Xia Zhang, Xi Qu Chen, Bin Feng Yang, Dong Ming Guo
Abstract: The components of material removal in wafer Chemical mechanical polishing (CMP) was described qualitatively based on theory of corrosive wear. The value of each component was obtained by a series of wafer CMP experiments. According to analyzing the experiment results, some conclusions are obtained as follows. There is an optimum polish velocity in wafer CMP at a certain parameter. Under the optimum velocity, the balance of interaction between the mechanical action and the chemical action is reached and the material removal rate approaches maximum. The wafer CMP is a changeful and dynamic process. It cannot be obtained ideal effect of material removal by increasing the mechanical action or chemical action only. The MRR in wafer CMP mainly depends on the interaction result between the mechanical action and the chemical action and the interaction made by abrasives is a decisive part. These results provide a theoretical guide to further understanding the material removal mechanism in wafer CMP.
354
Authors: Minoru Furukawa, Yukihide Fukuda, Keiichiro Oh-ishi, Z. Horita, Terence G. Langdon
Abstract: This paper describes experiments in which high purity copper single crystals of two different orientations were processed for one pass by equal-channel angular pressing (ECAP) and the deformed structures were examined using optical microscopy (OM), orientation imaging microscopy (OIM) and transmission electron microscopy (TEM). The first single crystal (0° specimen) was oriented within the entrance channel of the die so that the {111} slip plane and the <110> slip direction were parallel to the theoretical shear plane and shear direction, respectively. The second crystal (20° specimen) was oriented with the {111} slip plane and the <110> slip direction rotated by 20° in a clockwise sense from the theoretical shear plane and shear direction, respectively. For the 0° specimen, after passing through the shear plane there were two crystallographic orientations representing the initial orientation and an orientation rotated by 60° in a counter-clockwise sense from the initial orientation. For the 20° specimen, there was an orientation rotated by 20° in a counter-clockwise sense from the initial orientation after passing through the shear plane.
113
Authors: Gang Wang, Shi Ding Wu, Yan Dong Wang, Ya Ping Zong, Claude Esling, Liang Zuo
Abstract: Equal channel angular extrusion (ECAE) is an effective means of producing ultrafine-grained materials with extraordinary mechanical properties. Texture evolution and microstructure in pure copper single crystals processed by ECAE for up to five passes via route C are investigated to understand mechanisms of plastic deformation and grain refinement during ECAE. The experimental textures after the third pass ECAE process recovers that after one pass ECAE process. The main textures approaches a stable one after four passes of ECAE process via Route C while the intensity of main texture components decreases gradually. Local TEM-OIM measurements shows that grain subdivision in ECAE-processed samples occurs with the formation of many low angle grain boundaries.
929
Authors: F. Heidelbach, Jan Pospiech, H.R. Wenk
965
Authors: M. Benaissa, P. Humbert, H. Lefakis, G. Ehret, V.S. Speriosu, B.A. Gurney
697
Authors: Taku Sakai, Hiromi Miura
Abstract: Annealing behaviour was studied in deformed copper developed by continuous or discontinuous dynamic recrystallization (cDRX or dDRX). Pure copper was deformed to large strains by multi-directional forging at room temperature, resulting in an ultra-fine grained structure due to operation of cDRX. Subsequent annealing of such a fine-grained copper can be controlled mainly by grain growth accompanied with recovery and no texture change, that is continuous static recrystallization (cSRX). On the other hand, 4 kinds of static restoration processes operate during annealing of dDRXed copper, i.e. metadaynamic recovery and recystallization (mDRV and mDRX), and classical static recovery and recrystallization. The stable existence of mDRVed grains containing moderate dislocations leads to incomplete recrystallization even after a long period of annealing time. It is discussed how such various types of annealing processes, occurring in cDRXed or dDRXed matrices, can be connected with the characteristic nature of the deformed microstructures.
327
Authors: Satyam Suwas, Dong Ik Kim
Abstract: The paper deals with the evolution of recrystallization texture during annealing of Equal Channel Angular Extrusion (ECAE) processed copper with different deformation texture that may evolve as a result of different routes of ECAE. The deformation and recrystallization texture components have been separated and corresponding texture analysis has been carried out. An attempt has been made to understand the origin of recrystallization texture.
1353
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