Papers by Keyword: Cu-Fe Alloy

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Authors: Mikhail A. Uimin, A.Yu. Korobeinikov, Anatoly Ye. Yermakov, V.I. Khrabrov, A.K. Shtolz
289
Authors: Zhi Ming Zhou, Li Wen Tang, Min Min Cao, Bin Bin Lei
Abstract: CuFe10 and CuFe15 (mass fraction) alloys were prepared by vacuum induction melting and were cold rolled heavily at room temperature. Microstructure, microhardness and electrical conductivity of these alloys were measured at various cold rolled strain levels. The experimental results showed that the microhardness increased rapidly and the electrical conductivity decreases gradually with the increase of rolling strain at first. The microhardness increased slowly while the strain η greater than 2.3. The Fe-rich phases are deformed to ribbons filaments. However, the electrical conductivity increases again after deforming to a certain degree. The final electrical conductivities of heavily cold rolled CuFe10 and CuFe15 alloys were slight lower than vacuum inducing melted master alloys, however, the microhardness had increased about 44% and 47%, respectively.
847
Authors: Yun Lu, Yi Zhu He
Abstract: A Fep/Cu composite coating was developed based on laser cladding process in immiscible liquid system. The microstructure of the coatings is characterized by a homogeneous distribution of Fe-rich spherical particles dispersed in the Cu-rich matrix. The size of the Fe-rich spheres decreases and their number density increases with the decrease of the heating input. The micro-hardness and wear resistance results show that the micro-hardness of the composite coating (spherical particle (380 ~ 450 HV0.2) and the Cu-rich matrix about 200 HV0.2) is far better than that of the copper (70 HV0.2), the wear resistance of the composite coating is almost twice of the copper. Such Fep/Cu structure composite coating have a good combination of high strength and corrosion resistance (Fe-rich phase) and high electric and thermal conductivities (Cu-rich phase) with many potential advanced applications in electronic devices.
1864
Authors: Anatoly Ye. Yermakov, Mikhail A. Uimin, A.A. Mysik, A.Yu. Korobeinikov, A.V. Korolyov, N.V. Mushnikov, T. Goto, V.S. Gaviko, N.N. Shchegoleva
455
Authors: Ke Ming Liu, De Ping Lu, Hai Tao Zhou, Sheng Fa Wen, Shi Yong Wei, Qiang Hu, Zhen Zhen Wan
Abstract: Aging treatment of Cu-17Fe alloy was investigated by a vacuum heat treating furnace in high magnetic furnace. The microstructures were documented using scanning electron microscopy (SEM). The solid solubility of Fe in Cu matrix was analysed by energy spectrometer (EDS). The mechanical properties were measured with a Vickers hardness tester. The electrical conductivity was measured with a micro-ohmmeter. The results showed that high magnetic field can promote spheroidization of the Fe dendrites, the spheroidization intensifies and the solid solubility decreases with the increasing magnetic induction intensity of the high magnetic field exerted to the alloy, the solid solubility of Fe is minimum when the magnetic induction intensity is 10T at 500°C during precipitation. And Cu-17Fe alloy has a good strength/conductivity combination of 110Hv/63%IACS after aging treatment of 10T at 500°C for 1h.
1270
Authors: Hiromi Miura, Taku Sakai
Abstract: New thermo-mechanical processes (TMPs) to produce ultrafine-grained copper alloys utilizing continuous recrystallization (cRX) were proposed. These methods stand on our hypothesis that the evolution of ultrafine grains can be evolved by a mechanism of cRX even during severe plastic deformation at ambient temperature. A TMP of warm compression of 10 to 20 % of Cu-1.7mass%Fe alloy followed by annealing was cyclically repeated. The slight reduction, low-temperature annealing and pinning of grain boundaries by precipitates efficiently impeded occurrence of discontinuous recrystallization (dRX). The evolved substructures with nodes of the Fe precipitates gradually changed to new grains surrounded by low- and high-angle boundaries with increasing number of the repeated processes. Ultrafine grains with average size of 0.7 m were successfully evolved. However, the onset of dRX triggered extended grain coarsening accompanied by grain-boundary migration under conditions of insufficient annealing temperature and large pass stain. Another TMP cycles of cold rolling and annealing also induced fine-grained structure of about 0.6 m. The above results improved that ultrafine grain refinement can be realized simply by a mechanism of cRX even in the metallic materials with low stacking fault energy.
1983
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