Papers by Keyword: Dopant Diffusion

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Authors: Alexander Mattausch, M. Bockstedte, Oleg Pankratov
Abstract: We investigated the the interstitial configurations of the p-type dopants boron and aluminum and the n-type dopants nitrogen and phosphorus in 4H-SiC by an ab initio method. In particular, the energetics of these defects provides information on the dopant migration mechanisms. The transferability of the earlier results on the boron migration in 3C-SiC to the hexogonal polytype 4H-SiC is verified. Our calculations suggest that for the aluminum migration a kick-out mechanism prevails, whereas nitrogen and phosphorus diffuse via an interstitialcy mechanism.
Authors: Eddy Simoen, A. Satta, Marc Meuris, Tom Janssens, T. Clarysse, A. Benedetti, C. Demeurisse, B. Brijs, I. Hoflijk, W. Vandervorst, Cor Claeys
Abstract: The formation of shallow junctions in germanium substrates, compatible with deep submicron CMOS processing is discussed with respect to dopant diffusion and activation and damage removal. Examples will be discussed for B and Ga and for P and As, as typical p- and n-type dopants, respectively. While 1 to 60 s Rapid Thermal Annealing at temperatures in the range 400-650oC have been utilized, in most cases, no residual extended defects have been observed by RBS and TEM. It is shown that 100% activation of B can be achieved in combination with a Ge pre-amorphisation implant. Full activation of a P-implant can also be obtained for low-dose implantations, corresponding with immobile profiles. On the other hand, for a dose above the threshold for amorphisation, a concentration-enhanced diffusion of P occurs, while a lower percentage of activation is observed. At the same time, dose loss by P out-diffusion occurs, which can be limited by employing a SiO2 cap layer.
Authors: Takahisa Okino, R. Takaue, M. Onishi
Authors: W.D. Rau, P. Schwander, A. Ourmazd
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