Papers by Keyword: Electronic Equipment

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Authors: Gang Niu, Guo Shun Chen, Pei Yuan Wang
Abstract: Aimed at the characteristics that military electronic equipment has applied numerous technologies, many kinds of tested signals, the demands of test system’s accuracy and expansibility. Researched the test system based flexible test technology; the design ideas are structure modularization, electric interface standardization and software modularization. Especially analyzed modularization design, redundancy or parallel channels, calibration and system function test loop, flexible test can be applied well in the filed of military electronic equipment support.
316
Authors: Hong Xiang Li
Abstract: With the progress and development of modern society, various electronic equipments not only have been enriching our lives, but also have become an indispensable tool for people. At present, the electronic equipment is moving towards the direction of becoming more integrated, smaller and more accurate, which requires good dynamic performance and stability. This paper builds the finite element model and makes optimization and analysis for its structure through analyzing the dynamic performance of electronic components. On the basis of the analysis, this paper puts forward a new modeling method having the parametric substructure. In addition, the genetic algorithm is used to dynamically analyze and optimally combine the components on printed circuit boards. Finally through a concrete instance, this paper calculates its rationality and validity.
3194
Authors: Ruo Chen Song, Xiao Fei Sun, Yang Zheng, Hua Long Hu, Jin Hui Li
Abstract: the application of Internet of things (IoT) technology in solid waste management was analyzed, including key areas such as municipal solid waste (MSW), medical waste, hazardous waste, and waste electrical and electronic equipment (WEEE) management. Elaborates further in various fields of the main form of application and the application level at this stage. Also briefly analyses the trend and the direction of the development of the application.
797
Authors: Bo Li, Min Cao, Peng Fei Huang, Zhi Zhou Bi, Yuan Qiang Xiao, Can Mei Hong, Tao Xie, Ai Lian Liu, Qing Yang, Shang Fei Gao, Chuan Li
Abstract: Low-voltage power lines are not designed to transmit communication data; it is not ideal channel characteristics using power line as a data communication medium, especially the noise generated by the several of household electrical appliances will have a significant impact on the power line communication system. First, low-voltage power line carrier communication and channel noise characteristics are analyzed, and based on pure electricity environment UPS, the experimental results obtained with different electric appliances for data processing, and analyze the impact of the electric appliances noise on the power line carrier communication.
1429
Authors: Dong Wei Li, Guo Quan Ren, Zhao Shu Yang, Ben Li
Abstract: In order to study the reliability of the gun contained electronic equipment, take the fire control computer as an example,establish its physical model and then based on the modal analysis theory, dynamics simulation analysis for fire control computer is done by ANSYS. For vibration and shock which cause by the gun firing is harm to the equipment and the measures for vibration resistance is put forward. Through the contrast of the natural frequency of vibration isolated before and after finding that oscillator can effectively reduce the system nature frequency, and this could make the response amplitude is less than the excitation amplitude based on vibration isolator transmissibility curves. It could provide good conditions to ensure the box and its internal printed circuit board to meet the multiplier rule.
991
Authors: Ke Feng, Ben Sheng Lu, Huan Liang Li, Jun Han
Abstract: A fault testing device for the electronic instrument of certain type military equipment is developed in this paper. The PC104 bus, modular instrumentation and signal processing technology are integrated in the device. It consists of PC104 bus peripheral system, signal condition circuit, electric distribution cabinet, interface unit, connection cables and peripheral dedicated signal fixture. Based on Windows CE embedded operation system, the application program is implemented with Visual C++ programming language. The device could detect and locate the fault on replaceable unit of modular board and functional block, and could also assist serviceman and technical support personnel in performing quick fault testing and equipment maintenance.
661
Authors: Paula C. Oliveira, Marta Cabral, Carlos A. Nogueira, Fernanda Margarido
Abstract: In electronic appliances, printed circuit boards (PCB) represent an important component, containing high grade of valuable metals, besides organic resins and some ceramic materials. Copper is the major metal in PBC’s composition (normally higher than 20% w/w) but many other secondary and minor metal elements, including precious metals, are found in PCB’s. Recycling of PCB´s involves firstly the shredding operation, which is crucial in order to liberate particles from different materials, allowing its further processing by other mechanical, physical and chemical technologies. An efficient shredding operation is difficult to achieve due to the high heterogeneity of these wastes involving materials with different mechanical properties and complex assemblies. This paper presents results from laboratorial studies of shredding of PCB’s and the evaluation of size reduction efficiency as well as the chemical characterization of the obtained shredded fractions. Results showed that an efficient size reduction (characteristic average diameter d50=1.0mm) is obtained using two shredding stages of PCB’s, the first one with a grab shredder and the second one with a cutting mill. Chemical analysis of shredded PCB’s indicated that copper is the principal metal present (28%) followed by Sn, Zn, Pb and Al (3-5%) and many other minor elements. The fine fractions were rich in plastic materials while the metals were essentially present in the intermediate fractions (0.3-1.5 mm). These results can lead to guidelines regarding further design of the physical separation steps in the recycling processes.
1434
Authors: Zhen Guang Liang, Ming Yuan Yang
Abstract: Radiated electromagnetic interference (EMI) is an important criterion for electronic equipment to be met. In the paper, radiated EMI generated by electronic equipment is discussed. Several radiation structures are presented and approximate expressions of maximum radiated electric field are given. In order to reduce radiation of electronic equipment, its important to eliminate unintentional antenna structure and reduce maximum size of aperture and slot on shielding enclosure.
1469
Authors: Sheng Rui Yuan, Xun Yi Dang, Xiao Yu Yang, Long Bo Qu, Zhan Yu Zhan
Abstract: If there is no reliability, high-performance electronic devices indicator is no meaning. Reliability design, testing and verification methods of the vehicle electronic equipment are analyzed in this paper, and presented in the industry designed to improve the reliability of electronic equipment ideas, to regulate the reliability of electronic equipment designed to provide a technical basis.
411
Authors: Meng Jun Chen, Oladele A. Ogunseitan
Abstract: Due to shorter and shorter life span and the rapid development of flat panel display, plasma display panel (PDP) is now becoming a new kind of e-waste. In order to remove heavy metals, such as As, Ba, Cu, Zn, from waste PDP glass, electro-kinetic process was introduced and factors that affect heavy metal removing rate were investigated. Results showed that HNO3 concentration and PDP adding amount could significantly impact heavy metal removing rate, while current density was on the opposite. Heavy metal removing rate increased first and then decreased as the time extension. When PDP powders was 2 g, 9 mL 5 mol/L HNO3 was added, current density was 200 mA/cm2 and time was 6 h, the removal rate of As, Ba, Cu, Zn were 71.02%, 95.87%, 92.50% and 97.70%, respectively. As, Ba, Cu and Zn distributions in the cathode, anode and middle chamber varied as changing particle size, HNO3 concentration, current density. Generally, most Cu was concentrated in cathode chamber, and Zn in the anode chamber, while As and Ba would be in both cathode and anode chamber. As, Ba, Cu and Zn, in the middle chamber, no more than 10%, were the lowest among the three.
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