Papers by Keyword: Gold-Gold Thermocompression Bonding

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Authors: Jing Wu, Shi Xing Jia, Yun Xiang Wang, Jian Zhu
Abstract: The study is performed to implement the Gold-Gold thermocompression bonding for the wafer-level packaging of MEMS chips. Numerous experimental attempts have been carried out to select the metal film adhesive to avoid the Au-Si melt together and optimize bonding processes to intensify the Au-Au eutectic bonding. Finally the results display that the eutectic bonding of the gold-gold are arrived as electrical as well as mechanical interconnection of the MEMS structure and as seal as well as bonding intension.
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