Papers by Keyword: Gold Thin Film

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Authors: Shigeaki Kobayashi, Ryouta Fukasawa, Tadao Watanabe
Abstract: The evolution of grain boundary microstructures in gold thin films during annealing was investigated in order to find a clue to the development of high performance thin films by grain boundary engineering. The {111} oriented grains with the lowest surface energy were preferentially grown by surface energy-driven grain growth during annealing. The sharp {111} texture was developed by annealing at the temperature more than 873K. The remarkably high fraction of low-Σ coincidence site lattice (CSL) boundaries occurred when the area fraction of {111} texture increased to more than 95%. In particular, the fraction of some low-Σ CSL boundaries (Σ1,Σ3,Σ7) for the most sharply {111} textured specimen was found to be one order higher than those predicted for a random polycrystal. The utility of grain boundary engineering is discussed for controlling the performance degradation caused by the percolation phenomena of grain boundary diffusion in gold thin films.
2880
Authors: Attila Bonyár, Lászlo Milán Molnár, Gábor Harsányi
Abstract: A novel parameter called localization factor was calculated on contact mode atomic force microscope (AFM) images taken on gold thin film surfaces and was compared with the surface roughness parameters (Ra, RRMS). The aim of the investigation was to examine the dependence of these surface describing parameters on the background correction (generally post processing) of the AFM image. We found that the proposed localization factor parameter shows less dependence on the background correction compared to the surface roughness parameters and that it gives an identically characteristic value for four different thin film surfaces on the (1-100 μm2) scan range.
193
Authors: Jian Du, Jun Wei Di
Abstract: A simple one-step method was developed to electrodeposit gold thin film from HAuCl4 solution with cyclic voltammetric mode on indium tin oxide (ITO) coated glass. The color of as-prepared gold film can vary from red to blue due to different particle-particle interaction. The Au thin film comprised of isolated gold nanoparticles (GNPs) were red color, while blue gold thin films were obtained by electrodeposition in high HAuCl4 concentration and the increasing deposition cycles.
2271
Authors: Zohreh Deljoo Kojabad, Sohrab Sanjabi, Seyed Abbas Shojaosadati
Abstract: A low impedance electrode/tissue interface is critically important for neural microelectrodes recording to maintain signal quality. In this study, gold/polypyrrol thin films used to decrease the interface impedance. Gold thin film was electrodeposited by cyclic voltammetry in the potential range of-0.3 to 1 volt on the stainless steel surface of microelectrodes with 127 micrometer in radius. Then polypyrrole was electrodeposited on the gold layer. Electrochemical impedance spectroscopy tests were performed for impedance measurement of microelectrode surface. The effect of morphology and thickness on the impedance of thin film was studied. The results showed that the impedance of the microelectrodes with gold/polypyrrol coatings was 38.2% lower than the electrodes without coating in the neural frequency.
337
Authors: Naoya Tada, Ya Fei Hu
Abstract: Thin metal films on polymeric materials have been widely used in electronic devices. Their total mechanical performance is determined by the mechanical property of each material, the thickness and size of film and substrate, their interface properties in addition to the temperature change during production and use. In this paper, stress and strain distribution of gold thin film on polycarbonate substrate subjected to tension and cooling was analyzed using the finite element method. The effect of cracking in thin film on the stress and strain distribution was also discussed.
55
Authors: Jun Zhu, Jun Luo, Qing Meng Zhang, Qun Tang, Jun Du
Abstract: The electrical properties and microstructure of Na2O−PbO−Nb2O5−SiO2 glass-ceramic capacitors with pre-sputtered gold film as the transition layer in electrode design were investigated. SEM observation and EDS analysis showed that the presence of gold transition layer would eliminate enormously the Ag diffusion into the dielectric layer, resulting in a smooth and dense interface contact with less porous defects near the electrode/dielectric layer region. The electrical property results indicated that the leakage current and dielectric loss had decreased by about an order of magnitude and 20%, respectively. These results were explained by the weakened diffusion of silver into dielectric layer due to the presence of gold transition layer in between the silver paste/dielectric interface.
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