Papers by Keyword: Interface

Paper TitlePage

Authors: Fei Cao, Fen Fen Yang, Xue Jian Wang, Hui Jun Kang, Ya Nan Fu, Tong Min Wang
Abstract: Synchrotron X-ray radiography was used to in situ study the diffusion behavior and microstructural evolution of Al/Cu bimetal. The interface diffusion, dendritic/eutectic growth and the formation of intermetallic compounds around the Al/Cu bimetal interface were analyzed. During the isothermal diffusion process, a liquefied transition zone at the interface with a concentration gradient was formed when the Cu concentration exceeded eutectic composition of Al-Cu alloy. During the solidification of transition zone, the growth sequence of α-Al dendrites and eutectic structure were mainly dominated by the variation of Cu concentration and thermal field according to the temperature of the liquidus line of the equilibrium phase diagram. Finally, the transition zone around the interface were identified to be I (α-Al), II (Al+Al2Cu), III (Al2Cu) and IV (Al2Cu, AlCu and Al4Cu9), respectively.
Authors: Jean-Louis Chermant, F. Doreau, Jean Vicens
Authors: Jody Fronheiser, Kevin Matocha, Vinayak Tilak, Leonard C. Feldman
Abstract: The SiO2/SiC interface is characterized for carbon accumulation using the carbon isotope 13C as a marker layer combined with secondary ion mass spectroscopy (SIMS). SiC was epitaxially grown using an isotopically enriched propane source and subsequently oxidized to a thickness required to consume the entire 13C layer. Mass specific depth profiles through the oxide film yield residual carbon concentrations at or below 3x1011 cm-2. The depth resolution of SIMS and natural abundance of 13C in the bulk SiC film limit sensitivity but allow us to set a limit of 2.5x1014 cm-2 carbon build up at or near the interface.
Authors: Min Xie, Yu Zhang, Guo Man Liu
Abstract: In order to provide convenience for users to access the MIL-STD-1553B bus, a remote terminal FPGA interface is developed in this paper using 1553B protocol and BU61580 protocol chip. 1553B communication is implemented by a protocol chip which is controlled by FPGA logics. A simple port for users to receive and transmit data is designed. The operation mechanism of FPGA logics and the implementing methods of FPGA function modules are described in detail. Test results show the validity.
Authors: Hamid Reza Daghyani, A. Hosseini Monnazah, Lin Ye
Authors: Irene Guiamatsia, Giang Dinh Nguyen
Abstract: Failure develops and propagates through a structure via a complex sequence of competing micro-mechanisms occurring simultaneously. While the active mechanism of surface debonding is the source of loss of stiffness and cohesion, friction between cracked surfaces, upon their closure, acts as a passive dissipation mechanism behind the quasi-brittleness and hence can increase the toughness of the material under favorable loading conditions. In order to numerically study damage propagation, the constitutive response must be able to faithfully capture, both qualitatively and quantitatively, one of the signature characteristic of failure: the energy dissipation. In this paper, we present an interface decohesive model for discrete fracture that is able to capture the apparent enhancement of interfacial properties that is observed when transverse compressive loads are applied. The model allows to seamlessly account for the additional frictional dissipation that occurs when the loading regime involves transverse compression, whether during debonding or after full delamination. This constitutive model is then used to successfully predict the response of realistic engineering structures under generalized loading conditions as demonstrated with the numerical simulation of a fiber push-out test.
Authors: Dominique Leguillon, Sébastien Murer
Abstract: Cotterell and Rice theory (1980) on the kinking of a crack submitted to a biaxial loading in a homogeneous material has been recently revisited (Leguillon and Murer 2008). The mixed criterion for fracture which involves both an energetic and a stress condition (Leguillon 2002) allows defining a positive threshold of the T-stress below which no branching can occur (Selvarathinam and Goree 1998). This analysis enters within a more general mixed-mode analysis (I+II+T-stress). Despite the complex terms and the oscillations, results extend to interfacial cracks. The assumption of a crack jump as a consequence of the energy balance allows getting rid of the problem brought by the oscillations due to these complex terms. This approach brings a new insight on the prediction of crack kinking out of a bimaterial interface.
Authors: Akira Uedono, Long Wei, Y. Tabuki, H. Kondo, Shoichiro Tanigawa, Y. Ohji
Authors: Sharon Kao-Walter, Per Ståhle, Shao Hua Chen
Abstract: The crack tip driving force of a crack growing from a pre-crack that is perpendicular to and terminating at an interface between two materials is investigated using a linear fracture mechanics theory. The analysis is performed both for a crack penetrating the interface, growing straight ahead, and for a crack deflecting into the interface. The results from finite element calculations are compared with asymptotic solutions for infinitesimally small crack extensions. The solution is found to be accurate even for fairly large amounts of crack growth. Further, by comparing the crack tip driving force of the deflected crack with that of the penetrating crack, it is shown how to control the path of the crack by choosing the adhesion of the interface relative to the material toughness.
Authors: Hugo Biscaia, João Cardoso, Carlos Chastre
Abstract: The bonding between two different materials or between same materials is a quite popular method. Unlike fastener joints, it avoids undesirable stress concentrations and doesn't demand an intrusive application to ensure the good performance of the joint. However, depending on the configuration of the adhesively bonded joint, its performance responds differently and the choice (if possible to make) on the best configuration, i.e. the configuration that originates the highest strength and/or stiffness, may be hard to make. Within this context, several configurations of aluminium-to-aluminium bonded joints unstrengthened and strengthened with fiber reinforced polymers (FRP) were modelled using a commercial finite element code. The linearity and nonlinearity of the FRP composite and the aluminium were considered, respectively, and the adhesively bonded joints were subjected to a regular displacement that intended to simulate a tensioning load. Also, the nonlinearities of the interfaces were considered in the form of nonlinear cohesive adhesive laws. The fracture Modes I and II were defined trough a bond-slip relation with a bi-linear shape and the Mohr-Coulomb failure criterion is used for the coupling of the cohesive adhesive laws of the interface when the debonding process of the bonded joint configuration implies the interaction between both fracture modes, i.e. the joint is under a mixed-mode (Mode I+II) situation. The results are presented and discussed and the configurations of the bonded joints are all compared through bond stress distributions and load-slip responses. The study herein presented is, therefore, a contribution to the analysis of the structural integrity of bonded joints between FRP composites and aluminium substrates, helping also on the choice of the most adequate bonded joint configuration and corresponding reinforcement to be used and applied in practice.
Showing 1 to 10 of 858 Paper Titles