Papers by Keyword: Polishing Simulation

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Authors: Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida
Abstract: The miniaturization of semiconductor devices is advancing rapidly. The requirement for wafer flatness is becoming increasingly stringent as the use of shorter wavelengths in the latest laser lithography results in a smaller focusing depth of field. In our research, a flatness of 0.1 µm has been achieved over an entire 12" wafer surface by planarization with oscillation speed control type polishing. However, in addition it is necessary to increase the removal rate in order to reduce the polishing time. Although high rotational speed polishing is a solution to meet this requirement, the polishing characteristics change with the rotational conditions. Using a simulation program, we calculated that the stock removal saturates as the rotational speeds of the wafer and polishing pad are increased beyond a certain point. Also, experimental results showed that at high rotational speeds actual stock removal is significantly less than that indicated by the simulation, and that too much slurry causes unnecessary etching.
355
Authors: Da Wei Wang, Chao En Yin, Xian Hua Chen, Bernhard Steinauer
Abstract: Four groups of granite aggregates with different mineral structures were investigated. They were formed into test plates with a flat surface and polished with the Aachen Rafeling Tester using quartz powder and quartz sand as the polishing agent respectively. At the end of each polishing stage, the friction coefficient of these plates was measured with the skid resistance tester (SRT) and the Wehner/Schulze test apparatus (PWS), which represent different contact conditions. By comparison of the different friction development in the course of polishing, the influence of mineral composition and crystal size on the polishing resistance and friction coefficient of the aggregates is determined. This new methodology can be applied to evaluate the long-term skid resistance of the aggregates for road engineering.
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Authors: Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida
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Authors: Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida
Abstract: The size of the photo mask and mother glass used in liquid crystal display production has increased yearly. Large rectangular glass plates are difficult to planarize using rotary-type polishing machines. We have developed a rotary-type polishing machine with tool path control that is optimized by polishing simulation for a rectangular wafer. The present paper describes the planarization of a rectangular plate by simulation. The influence of tool size and the aspect ratio of the rectangular plate on the flatness are clarified. For a square plate, the flatness obtained under optimized oscillation speed is less than a quarter of that obtained under uniform oscillation speed. For rectangular plates with aspect ratios of 1:1.25 and 1:1.5, planarization using a tool having a diameter equal to half the diagonal length of the plate is shown to be difficult because the stock removal distributions in diagonal and short side of the workpiece become the different shape.
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