Papers by Keyword: Polymer Particle

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Authors: Y.S. Lu, Yasuhiro Tani, K. Soutome, Yasushi Kamimura
Abstract: This paper deals with a novel polishing technology using polymer particles. It has been proposed and developed by the authors for the purpose of solving the problems associated with polishing pads such as pad deterioration, process inconsistency and poor accuracy. Single side polishing of silicon wafers and double side polishing of quartz crystal square wafers were performed to clarify the basic characteristics of the technology. The results showed that appropriate combination of tool plate with polymer particles could greatly improve polishing characteristics. In particular, the edge profiles can be controlled to have desirable shape as well as amplitudes.
263
Authors: Naoaki Ichinoho, Junji Murata, Yasuhiro Tani, Takeshi Yanagihara, Miyuki Yamada
Abstract: The development of composite abrasives considering the cleanability of the polished work piece was previously reported. In glass polishing, composite abrasives exhibit improved polishing characteristics and result in superior cleanability in comparison with conventional polishing compounds. In this study, the application of these composite abrasives to the polishing of stainless alloy, cast iron and sapphire are investigated. New manufacturing methods and polymer particles are proposed for the various material applications. The experimental results show that composite abrasives improve the polishing removal rate for metal and sapphire substrates.
321
Authors: Yu Lou, Wei Yao Zhu, Xue Ling Zhang, Yun Qian Long
Abstract: Nano/micro polymer particles of acrylamide (AM), acrylic acid (AA), methyl methacrylate (MMA) are used to enhance oil recovery. Swelling kinetics of nano/micro polymer particles were investigated through experimental analysis and statistical analysis. The effect of salinity and temperature on swelling behavior over time is studied experimentally. The swelling kinetics of nano/micro polymer particle was described by second order kinetics. Equilibrium swelling ratio and swelling rate were obtained through nonlinear regression. The quantitative relationships between equilibrium swelling ratio and salinity, temperature were presented. Results show that the swelling ratio increases with increasing temperature or decreasing salt concentration. The study provides a direct perspective of swelling characteristics of nano/micro polymer particles for oil recovery enhancement.
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Authors: Xue Feng Xu, H.T. Ma, B.X. Ma, Wei Peng
Abstract: In order to increase the material removal rate of silicon wafer, composite abrasives slurry was used in CMP. The mechanism of interaction between silica abrasives and polymer particles was analyzed. Small silica abrasives were seen to attach onto the surface of the polymer particles. Composite abrasives slurry was obtained by adding polymer particles into single abrasive slurry. Three key parameters, the concentration of colloidal silica, the concentration of polymer particle and the speed of polishing, which influence the material removal rate of silicon wafer were analyzed by Taguchi method and the optimal parameters were obtained. Experimental results indicated that the maximum material removed rate of 353nm/min was obtained when optimal craft parameters of 5% colloidal silica, 3% polymer particle, 50rpm plate and carrier rotation speed were selected.
214
Authors: Wen Jun Zhou, Yasuhiro Tani
Abstract: A new concept of finishing technology, Multi-Body Finishing (MBF), is proposed to broaden the concept of Polymer Particles Assisted Polishing (POPAP, named also as 4-body finishing). In this paper, a new 4-body finishing technology is developed, in which paste dispersion medium is used and fine polymer particles are introduced as the 4th body to extinguish the microscratches and improve the dispersion stability of the polishing paste. It is verified that both high removal rate and high dispersion stability, compared to the conventional paste, can be obtained by using the new paste in which the low viscosity base agent is used and the media particles considerably finer than the abrasives are added.
267
Authors: Xue Feng Xu, H.F. Chen, H.T. Ma, B.X. Ma, Wei Peng
Abstract: In order to increase the material removal rate of silicon wafer, composite abrasives slurry was used in CMP. Zeta potential of polymer particle was measured and interaction potential energy between silica abrasives and polymer particles in slurry were analyzed and calculated. Adsorptions between silica abrasives and polymer particles were observed with TEM. CMP experiments had been taken to analyze the effects of polishing parameters (the concentration of colloidal silica and polymer particle, the pressure and the speed of polishing) on the material removal rate. The mechanism of polymer particle in polishing was elaborated. Experimental results indicated that PS, PMMA and BGF polymer particles could adsorb silica abrasives in slurry. Silica shell/PS core, silica shell/PMMA core and silica shell/BGF core particles could be used to formulate composite abrasives slurries. The material removal rate with composite abrasives slurry was higher than that of single abrasive slurry. The maximum material removal rate was obtained with silica shell/BGF core composite abrasives slurry.
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