Papers by Keyword: Silicon Wafer

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Authors: Hong Tsu Young, Hung Yi Huang, Ying Jay Yang

Abstract: The advantages of ductile regime grinding of silicon wafer such as smooth surface roughness (Ra < 10 nm) and minimum subsurface damage...

Authors: Feng Wei Huo, Zhu Ji Jin, Ren Ke Kang, Dong Ming Guo

Abstract: A new non-destructive method was developed to identify the grinding mode of silicon wafers, which is based on the information of subsurface...

Authors: Wen Jia Zuo, Xiao Hui Du, Hao Er Zhang, Yuan Zhe Su, Ting Ping Lei, Ling Yun Wang, Dao Heng Sun

Abstract: In this paper, a novel lapping method based on regulating the position of carrier centroid is proposed to modify interfacial normal pressure...

Authors: Jun Zhang, Bo Liu, Min Qian, Xiang Long Zhu, Ren Ke Kang

Abstract: A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-precision Grinding of Silicon Wafers

Authors: Y.B. Tian, Li Bo Zhou, Jun Shimizu, H. Sato, Ren Ke Kang

Abstract: The demand for extremely-thin Si wafers is expanding. Current manufacturing technologies are meeting great challenges with the continuous...

Authors: Wei Li, Xiao Dong Hu, Yang Fu Jin, Gang Xiang Hu, Xiao Zhen Hu

Abstract: Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get...

Authors: Chun Hui Chung

Abstract: Fixed diamond wire saw has the advantages such as higher cutting rate and clearer operating environment over the slurry wire saw in...

Authors: Takahiro Miyake, Toshiyuki Enomoto

Abstract: In recent years, the achievement of further high flatness of workpiece edge shape is strongly required in mirror finishing. Especially, the...

Authors: Y.S. Lv, Nan Li, Jun Wang, Tian Zhang, Min Duan, Xue Ling Xing

Abstract: In order to make the contact pressure distribution of polishing wafer surface more uniform during chemical mechanical polishing (CMP), a...

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