Papers by Keyword: Thermal Management

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Authors: Yutaka Furubayashi, Takafumi Tanehira, Kei Yonemori, Nobuhide Seo, Shin Ichiro Kuroki

Abstract: We propose 3-D integration of Peltier device onto a power device. In order to transport a heat from the power device, as a suitable material...

Authors: Cong Wang, Won Sang Lee, Nam Young Kim

Abstract: A novel silicon-based packaging platform with the electroplated-based reflector and the electrode- guided interconnections is developed for...

Authors: Ying Ying Zhang, Jing Dong Huang, Ying Zhang

Abstract: The thermal management is crucial to the safety and lifespan of Solid Oxide Fuel Cell (SOFC) generation system. For the model-predictive...

Authors: Jetsadaporn Priyadumkol, Chawalit Kittichaikarn

Abstract: The power trend of using server systems in data center is continuously increasing. Cooling system consumed 38% of total energy usage which...

Authors: Jean François Silvain, Valérie Denis-Lutard, Pierre Marie Geffroy, Jean Marc Heintz

Abstract: Today, there is a strong push to improve the thermal management of electronic components in order to increase the performance and the...

Authors: Y. Baik, Robin A.L. Drew
Authors: Eric Casenove, Loic Pujol, Alexis Vossier, Arnaud Perona, Vincent Goetz, Alain Dollet

Abstract: Experiments and simulations were carried out to assess a passive device for cooling photovoltaic cells under concentrated sunlight. The...

Authors: Fernand D.S. Marquis

Abstract: Owing to their exceptional stiffness, strength, thermal and electrical conductivity, carbon nanotubes have the potential for the...

Authors: Hendrik Weidmueller, Thomas Weissgaerber, Thomas Hutsch, R. Huenert, T. Schmitt, K. Mauthner, J. Schulz-Harder

Abstract: Electronic packaging involves interconnecting, powering, protecting, and cooling of semiconductor circuits for the use in a variety of...

Authors: Ludger Weber, Reza Tavangar

Abstract: Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by gas pressure infiltration into diamond...

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