Papers by Keyword: Wet Cleaning

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Authors: Günter Haas, Bipin Parekh, Jeremie Frankhauser, Benoît Viallet, Patrick Palka, Jérôme Bras
Authors: Francesca Milanesi, Francesco Pipia, Simona Spadoni, Salvo Grasso, Enrica Ravizza, Mario Pistoni, Mauro Alessandri

Abstract: The interest towards Copper RDL (Re-Distribution Layer) is due to some advantages related to this approach. First of all it is cheaper than...

Authors: Didier Lévy, Sébastien Petitdidier, H. Bernard, F. Guyader, C. Dezauzier, C. Pizzetti
Authors: Annamaria Votta, Francesco Pipia, Enrica Ravizza, Simona Spadoni, Silvia Rossini, Lucilla Brattico, Mauro Alessandri

Abstract: GST is an alloy composed by Ge, Sb, Te whose importance is increasing more and more in semiconductors manufacturing due to its usage in...

Authors: Katsuhiko Miya, Takuya Kishimoto, Akira Izumi
Authors: Sylvain Garaud, Rita Vos, Denis Shamiryan, Vasile Paraschiv, Paul W. Mertens, Jan Fransaer, Stefan De Gendt
Authors: Hiroshi Morita, Jun ichi Ida, T. Mizuniwa, Tadahiro Ohmi
Authors: Mike S. Ameen, Aseem K. Srivastava, Ivan L. Berry

Abstract: We have investigated the use of Rs and SIMS measurements to quantify substrate erosion due to plasma ashing and subsequent wet cleaning...

Authors: Francesca Milanesi, Silvio Vendrame, Enrica Ravizza, Simona Spadoni, Francesco Pipia, Luisito Livellara

Abstract: In a typical Power Device on the 0.16μm node, the isolation module is one of the most critical steps. The trench to be filled in those...

Authors: M. Schmidt, Guy Vereecke, Rita Vos, Frank Holsteyns, M. Baeyens, Paul W. Mertens
Showing 1 to 10 of 23 Paper Titles