Papers by Keyword: Copper Clad Aluminum

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Authors: Taek Kyun Jung, Hyouk Chon Kwon, Sung Chul Lim, Young Sup Lee, Mok Soon Kim
Abstract: We investigated about the effects of core material(Pure Al, Al3003) on extrudability such as the maximum extrusion ratio and the bonding strength of Copper Clad Aluminum(CCA) by indirect extrusion. As a results of this experiment, the maximum extrusion ratio of Cu/Al3003 was 38, which was larger than 21.39 of Cu/Al(Cu/pure Al). It was because that the difference of flow stress between copper as the sheath material and Al3003 as the core material was smaller than that of between copper and pure aluminum under the same extrusion temperature of 623K. The bonding strength gradually increased when the extrusion ratio increased, on the other hand, the bonding strength of Cu/Al3003 was higher than that of Cu/Al under same extrusion conditions. The diffusion layer thickness that affected bonding strength was not affected by the kind of core material, but it gradually increased when the extrusion ratio increased. It was thought that Cu/Al3003 had a more intimate diffusion layer than Cu/Al had because the extrusion pressure of Cu/Al3003 was higher than that of Cu/Al under the same extrusion conditions.
Authors: Yu Mei Dai, Yong Qing Ma, Yu Jie Dai
Abstract: By analysis of the theoretical calculation, it is obvious that the bimetallic bonding of the copper clad aluminum wire by clad drawing at room temperature is the action results of collective gravitation of a great lot of two metal surface atoms reciprocally by outside force. The interatomic potential energy of the closer atoms of two metal surfaces is obvious lower, so as to change for electron within the distance. The interdiffusion of the bimetallic surface atoms by clad drawing at room temperature, is good for improving the bond strength, but is not necessary.
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