Papers by Keyword: Hybrid Adhesives

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Authors: Toufik Djilali, Valérie Nassiet, Bouchra Hassoune-Rhabbour
Abstract: The objective is to design a joint, suitable for use from low to high temperature by combination of two adhesives along the overlap length in single lap joint. This mixed modulus concept is called Multi-module Bond line (MMBL). At high temperatures, a brittle adhesive (high modulus) in the middle of the joint retains the strength and transfers the entire load. At low temperatures, a ductile adhesive at the ends of the joint is the load-bearing adhesive. The first part of this work deals with the formulation of adhesives with differend stiffnesses to be used in the MMBL concept. Starting from a DGEBA resin/DETDA hardener system, different contents of amine terminated polysiloxane modifiers are added to the original mixture. A phase-separated structure is observed via scanning electron microscopy. The thermal, mechanical and dynamic viscoelastic properties of polysiloxane modified epoxy networks are studied. The second part of this paper will present the infinite element study of the assembly with two formulated adhesives in order to verify if they respect the MMBL concept.
Authors: José de Jesús Figueroa-Lara, Miguel Torres-Rodríguez, Mirella Gutiérrez-Arzaluz
Abstract: Hybrid adhesives epoxy-silica-zirconia were prepared and applied to bond aluminum sheet specimens. Silica nanoparticles were synthesized with the sol-gel “in situ” technique utilizing two different precursors, namely tetraethyl orthosilicate (TEOS) and 3 glycidyloxypropyltrimethoxysilane (GPTMS). Zirconia nanoparticles were prepared also with sol-gel technique and added to the hybrid adhesives before curing. The adhesive properties of the prepared materials were improved after performing several physical and chemical treatments to the aluminium specimens. The best apparent shear strength tests were for the adhesive hybrid materials prepared at 100°C with TEOS.
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