Papers by Keyword: Isotropic Conductive Adhesive (ICA)

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Authors: Seong Hyuk Lee, Jung Hee Lee, Jin Woon Lee, Jong Min Kim
Abstract: A new hybrid soldering and conductive adhesive joining technology using a fusible lowmelting- point alloy (LMPA) have been developed. A numerical method for numerical analysis of fusible particles behavior is proposed to investigate coalescence characteristics of fusible particles in solderable isotropic conductive adhesives (ICAs). For finding out suitable conditions to obtain reliable conduction paths, the present study examines the influence of process-related parameters such as volume fraction and viscosity on coalescence characteristics of fusible particles.
Authors: Qing Hua Li, Jian Hua Zhang
Abstract: Isotropic Conductive Adhesives (ICAs) were prepared using epoxy resin as matrix, latent curing agent as hardener, and silver particles as the conducting filler. The effects of nano-fillers (SiO2 nano-particles and carbon nanotubes) on the conductivity, adhension strength and reliability of ICAs were investigated experimentally in this paper. The results showed that these two nano fillers can improve both the conductivity and adhesion strength of ICAs, which maybe attributed to the nano-particles forming physico-chemical bonds with epoxy resin. These physico-chemical bonds increase the contact area and then minish the interspace of Ag particles, so it reduces electrical resistance and enables a high current flow. And the increasing contact area will improve the contact strength between Ag particles and epoxy resin. Under the reliability testing with the high temperature and high humidity (85°C/85RH), the SiO2 nano-particles can improve the reliability of ICAs apparently, while carbon nanotubes can not. This is because insulating material can prevent silver migration.
Authors: Rui Ming Yin, Liu Gong Wang, Hua Rong Yang, Piao Liu, Jing Li, Fu Bao Ji
Abstract: Based on epoxy resin, Aradur9506 as curing agent and Flake silver powders, isotropic conductive adhesives(ICA) were prepared, The effects of the functional groups of epoxy resin and the addition of curing agent in isothermal cure on the resistivity of the ECA were investigated by FT-IR method, scanning electron microscopy(SEM)and other means. The results indicated that tensile shear strength declined with the increased in the number of epoxy functional groups and raised with the addition of curing agent, and the tensile shear strength was inverse relationship with the curing shrinkage
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