Papers by Keyword: Micro-Electromechanical System (MEMS)

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Authors: Wayne A. Churaman, Luke J. Currano, Danny Gee, Eugene Zakar
Abstract: A no-power 3-axis bidirectional MEMS threshold accelerometer is presented in this paper. Threshold accelerometers of 25g, 50g, and 100g were designed and fabricated on a single 3mm chip. The design is based on a conductive spring-mass system made of Au metal layers that close a switch between two metal contacts when the designed threshold is exceeded. We present the MEMS threshold accelerometer switch fabrication process and provide an analytical and experimental framework for the device performance
Authors: Gang Wang, Li Xin Xu, Ting Wang
Abstract: High frequency filters are important components in microwave facilities application. With miniature volume, high performance and integratability, MEMS microstrip filter can significantly improve performance of Radio frequency system. By calculating chebyshev coupled microstrip bandpass filter design scheme, Threshold values of MEMS microstrip substrate parameters are defined to analyze dimensions variation property of MEMS microstrip filter relates with substrate parameters. Selection principle of substrate parameters for MEMS microstrip filter is presented, which indicates thickness and relative dielectric constant of substrate should not exceed the threshold values. The principle of threshold values can be applied as a guide on research and application of MEMS microstrip filter.
Authors: Kai Lin Pan, Jing Liu, Jiao Pin Wang, Jing Huang
Abstract: Through silicon vias (TSVs) provide advanced vertical interconnections solutions for system-in-package (SiP) (such as chip to chip, chip to wafer, and wafer to wafer stacking), wafer-level packaging, interposer packaging. At present the shortest electrical path (vertical electrical feed through) between two sides of a silicon chip is one of the important applications. In order to achieve high density and high performance package, TSVs technology has been developed. And for three-dimensional (3D) MEMS (Microelectromechanical System) packaging, TSVs are the most important enabling technology. In this paper, some advantages of TSVs technology are described, and process flow of TSVs module is introduced firstly. Subsequently, a novel electricity test method of Non-Ideal Planes for TSVs is introduced. Finally, many critical issues and challenges of TSVs are reviewed.
Authors: Takahiro Namazu, Y. Okamura, Y. Tashiro, Shozo Inoue
Abstract: This paper describes novel MEMS probe card device, which is composed of silicon (Si) cantilever beams actuated by titanium-nickel (Ti-Ni) shape memory alloy (SMA) films. Since Ti-Ni SMA film can yield a higher work output per unit volume, Ti-Ni film-actuated Si cantilever beam is expected to be a MEMS probe card device providing large contact force between probe and electrode pad. The developed cantilever beam produces a contact force by not only cantilever bending in contact but also the shape memory effect (SME) of Ti-Ni film arising from Joule’s heating. The SME of Ti-Ni film containing Ti of 50.5 atomic (at.) % to 53.2 at. % can generate an additional contact force of 200 μN on average under applying an electric power of 500 mW to the film. Ti-Ni film-actuated Si cantilever beam would be a key element for successful MEMS probe card with larger contact force and smaller size.
Authors: Guang Yi Shi, Yue Xian Zou, Wen J. Li, Yu Feng Jin, Pei Guan
Abstract: This paper introduces a novel approach for human motion recognition via motion feature vectors collected by A Micro Inertial Measurement Unit (µIMU). First, µIMU that is 56x23x15mm3 in size was built. The unit consists of three dimensional MEMS accelerometers, gyroscopes, a Bluetooth module and a Micro Controller Unit (MCU), which can transmit human motion information through a serial port to a computer. Second, a human motion database was setup by recording the motion data from the µIMU. The motions include fall, walk, stand, run and step upstairs. Third, Support Vector Machine (SVM) training process was used for human motion multi-classification. FFT was used for feature generation and optimal parameter searching process was done for the best SVM kernel function. Experimental results showed that for the given 5 different motions, the total correct recognition rate is 92%, of which the fall motion can be classified from others with 100% recognition rate.
Authors: Wu Zhang, Ji Fang Tao, Wei Ming Zhu, Hong Cai, Ai Qun Liu
Abstract: In the broadband communication network, the wavelength-division-multiplexed (WDM) system is widely used to maximize the information that the signals can carry. As a result, the number of channels which are carried by different optical wavelengths in the WDM optical fiber network also keeps increasing. To separate the huge number of different wavelength signals, optical filter is required. The optical filter based on semiconductor has been widely studied due to the maturation of semiconductor fabrication technology and that it is possible to integrate the filter with the stable semiconductor devices such as laser diodes and MOSFETS. The tunable optical filter is basically a selective optical resonator that only allows the resonant modes passing through. Various mechanical methods are studied to achieve the tunable effect by tuning the physical structure of the filter; however, there is not much research on how the semiconductor material will affect the tuning function. In this paper, the author studied the influence of refractive index of the multi-silicon-slabs on the filter, whereby the tuning of refractive index is reached by thermal effect. It is found by simulation that when heating the silicon slabs, the increasing refractive index of silicon will lead to a shift of the resonant mode wavelength. This shift is almost linear with the change of the temperature, which is about 1nm with every 20K temperature increase. For certain devices, the result of the simulation showed it is possible to tune the resonant mode from C band to L band in the Fiber Optical Communication.
Authors: Chao Heng Chien, Hui Min Yu
Abstract: It presented a novel manufacturing method that was derived from traditional hot embossing technology to fabricate actuators on polymer material in this paper. The conventional photolithography technology, electroplating, and hot embossing technology were utilized in this process. The plastic deformation properties of thermoplastic polymers were main concept. The metal layer deposited on the silicon wafer could be embedded into the polymer substrate by hot embossing technology as temperature being above Tg. When the polymer substrate temperature was cooled below the Tg, the polymer is to de-embossing and remove silicon wafer. The metal layer was transferred from silicon wafer to be embedded in the polymer substrate. Owing to the adhesion between the metal layer and polymer material was more than the metal layer and silicon wafer. For instance, the PMMA was employed as the polymer substrate to fabricate the cantilever beam actuator using the novel technology. Finally, the beam was driven by electrostatic force through 25volts of DC power.
Authors: Markus Krüger, Christian U. Grosse, Pedro José Marrón
Abstract: So far, the inspection of building structures and especially of bridges is mainly done visually. Therefore, the condition of the structure is examined from the surface and the interpretation and assessment is based on the experience of the expert. However, the main purpose of monitoring civil structures is not to substitute visual inspection. Continuous structural health monitoring should provide data from the inside of a structure to better understand its structural performance and to predict its durability and remaining life time. Monitoring should render objective data and observable alterations in the structure continuously, which cannot be done by visual inspection. More detailed information is needed with respect to different exposure due to dynamic and static loads and also temperature and moisture. Today mainly wired monitoring systems are used to monitor structures, which are relatively expensive and time consuming to install. In this paper the basic principle of a wireless monitoring system equipped with MEMS sensors is presented, which can be easily installed at different structures. Microelectromechanical systems (MEMS) are small integrated devices or systems that combine electrical and mechanical components. A wireless monitoring sensor network equipped with such MEMS could be produced with a very low budget and becomes very efficient. This permits a wide area of applications not only in civil engineering. With respect to different applications relevant properties of a wireless monitoring system are described. In detail network configuration, power consumption, data acquisition and data aggregation, signal analysis and data reduction as well as reliability and robustness are discussed.
Authors: Kazuto Tanaka, Kohji Minoshima, Takehiro Imoto
Abstract: To analyze the effect of the crystal orientations and the grain size on the Young's modulus of thin polysilicon microelements, two-dimensional finite element models in plain strain condition were developed using a Voronoi structure. The number of grains in a model of a 10 μm square area was changed from 23 to 1200. The grain size and the crystal orientation of the film were analyzed by means of an electron back-scattering diffraction pattern (EBSP) method. The average grain size of the front surface of the thin film was about 0.69 μm, which is almost equal to the grain size of the Voronoi model having 300 grains. From the results of EBSP analysis, the specimen had no oriented structure. Therefore, random crystal orientation was given to each grain of the FEM models. When the number of grains increased, the Young's modulus converged on about 171 GPa and its scatter caused by the different sets of the random orientation was reduced. The Young's modulus obtained by the FEM analysis was larger than the value obtained by the tensile tests.
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