Papers by Keyword: Microelectronics

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Authors: Anthony J. Walton, Stewart Smith
Abstract: This paper reviews present day test structures and illustrates how they have evolved to a continuously changing technology. Structures for measuring resistivity, contact resistance, feature dimensions and overlay errors are presented as are MEMS (Micro-Electro-Mechanical Systems)/microsystems specific devices.
356
Authors: Praveen Meduri, Shirshak Dhali
Abstract: In this paper, we propose a novel methodology to automate the transistor-level sizing of OpAmps. Given the netlist and the specifications of the OpAmp, our methodology automatically produces a set of monomial design equations that can be solved using a geometric programming. The use of monomial models eliminates the overhead of generating elaborate posynomial design equations. This approach produces a design that has the accuracy of the BSIM models used for simulation and the advantage of a quick design time. The results of a two stage OpAmp designed in TSMC 0.25μ technology prove the efficacy of our approach.
336
Authors: Shuai Kang, Jue Long Li, Jian Chun Xing, Li Qiang Xie, Xiao Bo Wang
Abstract: —In view of the inefficiency of coding, the complexity of signal extraction and the strict demands of machining in the existing multiple SAW tags system, an anti-collision technique based on Walsh Code was proposed. First, it encodes the 2PSK using the single antenna transmission structure, then it implements the orthogonal encoding of each tag in a multiple SAW tags system using Walsh coding, and finally the encoding information of each tag is acquired by reading the echo signals from the reader and doing cross-correlation operation with each code block in the orthogonal code-set. The proposed approach incorporates both the coding efficiency and the processing technology, simplifies the complexity of signal extraction, and achieves the goal of anti-collision of multiple SAW tags system. The theoretical analysis and simulation verify the feasibility of this technique.
222
Authors: Xian Zhang Feng, Liang Ji Chen, Jun Wei Cheng
Abstract: Micro-electromechanical systems is called MEMS for short, it is the product of mutual integration for the micro-electronics and micro-mechanics, which covers mechanical, electrical, physical, biological and other modern technology. MEMS packaging is a key technology that has been developed based on electronic package technology. In order to strengthen the development of packaging process of MEMS, in particular, which are low cost, materials and packaging technology and has an ideal effect. The characteristics of MEMS packaging technology based on MEMS technologies are introduced, and the future development tendency and application of MEMS device packaging are previewed in this dissertation.
274
Authors: Alexandre A. Ivanov, Vasily I. Tuev, Anatoly A. Vilisov
Abstract: The sol-gel synthesis of filled aluminosilicates (FAS) has been developed. Such FAS consist of dendrimer morphology macromolecules capable to accommodate as a filler up to 70 % wt of high-refractory nitrides and oxides of high-melting compounds. The study of the obtained ceramic coatings on the developed metal surfaces has showed their use prospects to develop an ion beam control electrode in the ion plasma machine, microelectronics, and LED technology.
188
Authors: Luciano Arruda, Cristiano Coimbra, João Marco Andolfatto
Abstract: This work is related to reliability of strain measurement in flexible printed circuit boards (fPCBs) made with polyimide substrate. It was observed that the fPCBs are very sensitive to strain mounting stiffness. The indirect measurement method will be done employing High Speed Camera (HSP). The direct method will be formulated in two ways: 1) conventional strain gauge glued in an fPCBs; 2) printed strain gauge in a polyimide substrate. This paper will point out mistakes and show advantages when using different method to extract the deformation field of the selected area in a flexible thin film.
88
Authors: Núria Llorca-Isern, Cristina Artieda-Guzman, Jose Alberto Vique, Antoni Roca
Abstract: Nanocrystalline composite powders were prepared by mechanical alloying of pure Cu, Fe and Co as metallic major part and Al2O3 or Fe2O3 or SiO2 as ceramic reinforcement in a high-energy ball mill. Alloys of the copper-iron-cobalt system are promising for the development of new materials and applications. Cu-Fe-Co is used in different applications depending on the properties required. These can be related for example to toughness when used as rock cutting tool, to magnetic and electric properties for microelectronics or to chemical behaviour when used as catalysts in bioalcohol production industry. The objective of the present study is to contribute to understanding how and to which amount the ceramic reinforcement affects the properties for which this Cu-Fe-Co system is used as well as to envisage other less frequently uses for the composite powders. Structural and magnetic transformations occurring in the material during milling were studied with the use of X-ray diffraction, scanning quantum induction device (SQUID) and magnetic force microscopy (MFM). In mechanical alloying the transformations depend upon milling time. The results showed that milling the elemental powders of Cu-Fe-Co in the mass proportion of 50:25:25 respectively for times up to 10h leads to the progressive dissolution of Fe and Co atoms into FCC Cu and the final product of the MA process was the nanocrystalline Cu containing Fe and Co with a mean crystallite size (from coherent crystal size determination by diffraction) of 20 nm aprox. When ceramic particles are milled together with the metals (at proportions of the oxides between 1-10%) this mechanism is retarded. On the other hand, the lowest mean crystallite size is reached without ceramic particles in the milling process. However the composite powder produced in all the cases stabilized similar lowest crystallite size between 45-50 nm. Mechanically alloyed metallic-ceramic composite powder showed lower saturation magnetization than the metallic system but enhanced coercive field (significantly for hematite reinforcement). All the studied systems are intermediate ferromagnetics (Hc≈104 A/m). Milling time significantly affects the structure, composition and properties for both metallic and composite systems.
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Authors: A. Saerens, Paul van Houtte, A. Witvrouw
556
Authors: Nathan Young, Jay Johnson, Kevin G. Ewsuk
Abstract: Packaging high power radio frequency integrated circuits (RFICs) in low temperature cofired ceramic (LTCC) presents many challenges. Within the constraints of LTCC fabrication, the design must provide the usual electrical isolation and interconnections required to package the IC, with additional consideration given to RF isolation and thermal management. While iterative design and prototyping is an option for developing RFIC packaging, it would be expensive and most likely unsuccessful due to the complexity of the problem. To facilitate and optimize package design, thermal and mechanical simulations were used to understand and control the critical parameters in LTCC package design. The models were validated through comparisons to experimental results. This paper summarizes an experimentally-validated modeling approach to RFIC package design, and presents some results and key findings.
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