Papers by Keyword: Nanoindention

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Authors: Yung Jin Weng, Yung Chun Weng, Hsu Kang Liu, Lin Hsiung Chiu
Abstract: In this study, we try to produce SU-8 photoresist microstructure devices using nano-imprint technology, and try to conduct nano-indention tests on SU-8 photoresist with nano-indention detector, in order to describe the behaviors and characteristics of nano-indentions on SU-8 microstructure devices and establish the deformation mode for the indention under nano-meter level. The tests tell us that, after nano-indention tests, the result indention hardness increases with the loading rate, indention repeats, and reduction of load or depth. Similarly, the indention hardness decreases because of reduction of loading rate, extension of loading time, and increase of load, and depth. Finally, we propose a deformation mode for nano-indention. This mode can also be used to explain the deformation behavior of SU-8 under nano-indention.
Authors: Yi Si
Abstract: The deformation and mechanical properties of Zr-based bulk metallic glasses (BMGs) under a nanoindenter and the effect of cooling rate, the effect of cooling rate, tungsten fiber addition and annealing on them have been studied by means of a nanoindentation instrument and a scanning electron microscope (SEM). The results indicate that the deformation of Zr-based BMGs under a nanoindenter is characterized by multiple shear bands and viscous flow which confirms the existence of a amount of plastic deformation. For pure quenched Zr-based BMGs, the larger the size of samples or the nearer the location away from the surface of a same sample, the smaller the values of microhardness (Hv) and elastic modulus (E); Annealing and tungsten fiber addition enhance the values of Hv and E; meanwhile, they also significantly change morphology around a nanoindenter and the amount of plastic deformation. The mechanism of plastic deformation is preliminarily analyzed.
Authors: Jen Ching Huang, Yung Jin Weng
Abstract: This study used the nanoindenter to perform indentation tests on copper bulk and nano copper film in order to discuss the mechanical properties of pure copper at the nano scale. This study tested 7 levels of load, ranging from 20 to 200 μN (load increment at 30 μN) for the indentation tests on copper bulk and nano copper film specimens. Results showed that the load was roughly proportional to the residual depth, in the case of flat nano copper film, while the relationship between the load and the residual depth was not significant in the case of unsmooth copper bulk. Moreover, the hardness of both the copper bulk and the nano copper film would increase along with increasing load, while the Er value change trends of both the copper bulk and the nano copper film specimens differed with increasing load.
Authors: Yu Li Sun, Dun Wen Zuo, Duo Sheng Li, Rong Fa Chen, Min Wang
Abstract: Hardness, elastic modulus and scratch resistance of single silicon wafer are measured by nanoindentation and nanoscratching using a nanoindenter. Fracture toughness is measured by indentation using a Vickers indenter. The results show that the hardness and elastic modulus at a peak indentation depth of 100 nm are 12.6 and 166.5 GPa respectively. These values reflect the properties of the silicon wafer, the bulk material. The fracture toughness value of the silicon wafer is 0.74 Mpa·m1/2. The material removal mechanisms are seen to be directly related to the normal force on the tip. The critical load and scratch depth estimated from the scratch depth profile after the scratching and the friction profile are 138.64 mN and 54.63 nm respectively. If the load and scratch depth are under the critical values, the silicon wafer will undergo plastic flow rather than fracture. The critical scratch depth is different from that calculated from the formula of critical-depth-of-cut described by Bifnao et al and some reasons are given.
Authors: J. Zhu, Dun Wen Zuo, Nanju Gu, Zu Hong Lu
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