Papers by Keyword: Polishing

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Authors: Hwa Soo Lee, S. Sasaki, T. Yamada, K. Mizukawa, Y. Ono
Authors: Cong Rong Zhu, Ju Long Yuan, Bing Hai Lv, Zhao Zhong Zhou
Abstract: This paper focuses on the application of Taguchi method for optimization of SUS440 stainless steel polishing process parameters to obtain the best finish. An optimization experiment for polishing stainless steel with SiO2 was designed by Taguchi method. Surface roughness Ra is considered as criteria for optimization. Influence of parameters involving load, speed, and slurry concentration for a given workmaterial with given abrasive (material and size) are discussed, and the optimum polishing conditions are figured out. Compared with single parameter experimental results, it illustrates that the experiment design based on Taguchi method can successfully applied to determine the optimum processing conditions for SUS440 stainless steel polishing process.
Authors: Y.S. Lu, Yasuhiro Tani, K. Soutome, Yasushi Kamimura
Abstract: This paper deals with a novel polishing technology using polymer particles. It has been proposed and developed by the authors for the purpose of solving the problems associated with polishing pads such as pad deterioration, process inconsistency and poor accuracy. Single side polishing of silicon wafers and double side polishing of quartz crystal square wafers were performed to clarify the basic characteristics of the technology. The results showed that appropriate combination of tool plate with polymer particles could greatly improve polishing characteristics. In particular, the edge profiles can be controlled to have desirable shape as well as amplitudes.
Authors: Rainer Boerret, Andreas Kelm, Helge Thiess, Volkmar Giggel
Abstract: ASPHERO5 is a funded German research project (project prime: Schneider OpticalMachines) with the goal of economic fabrication of high precision aspheres. The research is concentrated on the classical process chain consisting of grinding and polishing. The characterization of the incoming and outgoing surface quality is one issue to characterize the improvements. The variation of the local removal rate related to local curvature is one of the limiting factors of the polishing process. In this paper we report on first results characterizing the surface quality with a PSD (Power Spectral Density) algorithm and analyzing the local removal rates for the polishing step. In our research, two types of aspheres with 30 and 60 mm diameter were polished with a spinning tool process. The final deviation between simulation and experiment was less than 10 percent. That’s the starting point for further investigations within the project.
Authors: Mutsumi Touge, Satoru Anan, Shogo Wada, Akihisa Kubota, Yoshitaka Nakanishi, Junji Watanabe
Abstract: The ultra-precision polishing assisted by the ultraviolet rays irradiation was performed to achieve the atomic-scale planarization of the single crystal diamond substrates. This polishing method is a novel and simple polishing method characterizing by a quartz disk and an ultraviolet irradiation device. The principle three crystal planes of the diamond substrate were polished by this method. The polished surfaces were evaluated by an optical interferometric profilers (Wyko), an atom force microscope (AFM) and LEED (low-energy electron diffraction). The surface roughness of the polished diamond substrates was evaluated as 0.2 ~ 0.4 nmRa in (100), (110) and (111) crystal planes. The LEED (low-energy electron diffraction) patterns indicated the almost perfect crystallographic structure without the residual processed strain beneath the polished surface. In this paper, the optimum polishing condition to achieve the atomic-scale planarization of the diamond substrates has been investigated by the evaluation of LEED patterns, Wyko and AFM images. The mechanismof the ultraviolet rays assisted polishing is discussed in detail.
Authors: Xiao Jun Wu, Shu Dong Sun, Chao Zheng
Abstract: Die and mold are constructed with various free surfaces. In the machining of die and mold, it takes a long time to finish the curved surface. In this study high accurate polishing technique by GC (grinding center) with elastic ball type wheel is developed. In polishing process it is very important to remove cusp height without decreasing machined form accuracy. It is available to use GC in free surface grinding and finishing of die and mold with elastic ball type wheel. In polishing process only cusp height is removed in order to keep form accuracy that is produced in cutting process with ball end mill. In order to know the polishing characteristics of elastic ball type wheel, basic experiments were conducted. The polishing parameters Sp. were obtained experimentally by changing the values of polishing process. Using polishing parameter, removal amount can be obtained and polished surface is possible to estimate.
Authors: Ya Fei Ou, Xiao Chu Liu, Chuan Jian Liu, Wen Xiong Li, Hao Wang
Abstract: To further understand the bearing performance’s influence of the plastic deformation after balls and bearing rings surface multiple collision in ball bearing’s strengthening and polishing processing by the strengthening and polishing machine. ABAQUES software is used for finite element analysis in the three-dimensional modeling of multiple collision, and the plastic strengthen the performance of bearings is researched mainly. The results shows that the raceway surface is significant plastic strengthen in multiple collisions, Yield ability is enhanced largely, and surface residual stress state present for the compressive stress. Raceway surface strengthening process requires a particular number of times to ensure the processing, with strengthening processing times increasing, bearing raceway surface strength is saturated, then, the number continued to increase to strengthen, the surface strength is no significant increase. But after the collision of ball, uniform residual compressive stress is forming in the bearing surface, good for improving the fatigue strength and bearing life.
Authors: Yasushi Ido, Keisuke Asakura, Hitoshi Nishida
Abstract: Behaviors of both micrometer-size nonmagnetic abrasive particles and micrometer-size magnetic particles in a magnetic fluid are investigated by using the discrete particle method which is based on the simplified Stokes dynamics. Sheet-like clusters of nonmagnetic particles and sheet-like clusters of magnetic particles alternately appear one after another in the axis direction when the flow velocity is small.
Authors: Yasushi Ido, Keisuke Asakura, Hitoshi Nishida
Abstract: Behavior of both suspended micrometer-size magnetic particles and micrometer-size nonmagnetic abrasive particles in a micro-tube filled with a magnetic compound fluid is investigated by using discrete particles method based on the simplified Stokesian dynamics in order to reveal the polishing process of inner surface of the tube with an axial flow. Giving the axial flow of the appropriate velocity is effective on performing uniform polishing of the surface in the magnetic compound fluid polishing.
Authors: Ji Sheng Sheng, Dong Hui Wen, Shi Ming Ji
Abstract: Ceramic materials are widely used in the fields of aviation, chemical industry, military, machinery, electronics, so there are so many researches on ceramic materials. This article is mainly about ceramic sample preparation by polishing process for nano-indentation, taking Alumina ceramic and Zirconia ceramic for example. As we know, nano-indentation test is an effective mean to study materials. It is concluded that after polishing, the ceramic surface roughness can reach Ra<10nm and maximum scratches<1nm, flatness<1μm, we can get good quality surface, that well meets the surface requirements in nano-indentation.
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