Papers by Keyword: Schottky Diode

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Authors: Alexander A. Lebedev, S.V. Belov, Marina G. Mynbaeva, Anatoly M. Strel'chuk, Elena V. Bogdanova, Yu.N. Makarov, A.S. Usikov, Sergey Kurin, I.S. Barash, Alexander D. Roenkov, Vitalii V. Kozlovski
Abstract: Schottky-barrier diodes with a diameter of ~10 μm are fabricated on n-GaN epitaxial films grown by hydride vapor-phase epitaxy (HVPE) on sapphire substrates. The changes in the parameters of the diodes under irradiation with 15 MeV protons are studied. The carrier rate was found to be 130-145 cm-1. The linear nature of the dependence N = F (D) (N is carrier concentration, and D, the irradiation dose) shows that compensation of the material is associated with transition of electrons from shallow donors to deep acceptor levels which are related to primary radiation defects.
Authors: Dethard Peters, Karl Otto Dohnke, Christian Hecht, Dietrich Stephani
Authors: Konstantin Vassilevski, Irina P. Nikitina, Alton B. Horsfall, Nicolas G. Wright, C. Mark Johnson
Abstract: 3.3 kV rated 4H-SiC diodes with nickel monosilicide Schottky contacts and 2-zone JTE regions were fabricated on commercial epitaxial wafers having a 34 m thick blocking layer with donor concentration of 2.2×1015 cm-3. The diodes were fabricated with and without additional field stop rings to investigate the impact of practically realizable stopper rings on the diode blocking characteristics. The field stop ring was formed by reactive ion etching of heavily doped epitaxial capping layer. The diodes with field stop rings demonstrated significantly higher yield and reduction of reverse leakage current. The diodes demonstrated blocking voltages in excess of 4.0 kV and very low change of leakage current at ambient temperatures up to 200 °C.
Authors: Yoshitaka Sugawara, Katsunori Asano, Ryuichi Saito
Authors: J. Wu, Leonid Fursin, Yu Zhu Li, Petre Alexandrov, Jian Hui Zhao
Authors: Jim Richmond, Sei Hyung Ryu, Sumi Krishnaswami, Anant K. Agarwal, John W. Palmour, Bruce Geil, Dimos Katsis, Charles Scozzie
Abstract: This paper reports on a 400 watt boost converter using a SiC BJT and a SiC MOSFET as the switch and a 6 Amp and a 50 Amp SiC Schottky diode as the output rectifier. The converter was operated at 100 kHz with an input voltage of 200 volts DC and an output voltage of 400 volts DC. The efficiency was tested with an output loaded from 50 watts to 400 watts at baseplate temperatures of 25°C, 100°C, 150°C and 200°C. The results show the converter in all cases capable of operating at temperatures beyond the range possible with silicon power devices. While the converter efficiency was excellent in all cases, the SiC MOSFET and 6 Amp Schottky diode had the highest efficiency. Since the losses in a boost converter are dominated by the switching losses and the switching losses of the SiC devices are unaffected by temperature, the efficiency of the converter was effectively unchanged as a function of temperature.
Authors: Petre Alexandrov, B. Wright, M. Pan, M. Weiner, Leonid Fursin, Jian Hui Zhao
Authors: Antonella Sciuto, Fabrizio Roccaforte, Salvatore di Franco, Vito Raineri, S.F. Liotta, Sergio Billotta, Giovanni Bonanno, Massimiliano Belluso
Abstract: The fabrication of high sensitive diodes array is very attractive for spectroscopic and astronomical UV imaging applications, particularly when visible light rejection is required. Wide band gap materials are excellent candidates for UV “visible blind” detection. In this paper, we demonstrate an array of Schottky UV-diodes on 4H-SiC with a single pixel area of about 1.44 mm2 and a total area of about 29 mm2. The Schottky photodiodes are based on the pinch-off surface effect, the front electrode being an interdigit Ni2Si contact that allows the direct light exposure of the optically active device area. For the proposed array, the optically active area is about the 48 % of total area. The single pixel dark current was below 0.1 nA up to –50 V and a fabrication yield of about 90 % was observed. The external quantum efficiency of the proposed array exhibits a peak of 45 % at the 289 nm wavelength and a visible rejection ratio > 4 ×103.
Authors: Denis Perrone, Marco Naretto, Sergio Ferrero, Luciano Scaltrito, C. Fabrizio Pirri
Abstract: We have studied different Schottky and ohmic contacts on 4H-SiC with the aim to obtain Schottky barrier diodes (SBDs) capable to operate at high temperatures, frequencies and power densities for long periods of time, and showing low power losses. The control of the Schottky barrier plays an important role in minimizing the power loss of a SBD, and the metal-semiconductor interface properties strongly affect the overall performances of such a device. Schottky contacts were deposited using Ni, Ti, Ti/Al, Mo and Mo/Al layers, and the annealing treatments have been performed up to 600 °C using a rapid thermal annealing process (RTA). Ohmic contacts have been deposited on the wafer backside using Ti/Al or Ti/Ni/Ag layers. The Schottky diodes have been characterized by means of standard current-voltage (I-V) and capacitance-voltage (C-V) techniques. Schottky diodes with Mo and Mo/Al barriers show a lower barrier height and better overall performances in forward polarization when compared to the Ti- and Ni-based contacts.
Authors: Gheorghe Brezeanu, Florin Draghici, F. Craciunioiu, C. Boianceanu, F. Bernea, F. Udrea, D. Puscasu, Ion Rusu
Abstract: 4H-SiC Schottky Barrier Diodes (SBDs) with remarkable electrical performance have been fabricated and characterised. A barrier height about 1.64V and an ideality factor close to 1 are extracted from the forward characteristics measured at several temperatures. These essential Schottky contact parameters are observed to be constant with temperature. A temperature probe with a simple and innovative scheme is designed and applied. The probe uses SiC SBDs as temperature sensor in the 20-4000C range, with measured sensitivities varying from 1.3 mV/K to 2.8 mV/K. The probe is meant to monitorize the temperature inside the furnaces, in the cement industry.
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