Papers by Keyword: SiC Single Crystal

Paper TitlePage

Authors: S. Heo, H.R. Son, Byung Sook Kim, M.S. Kim, J.E. Han, Dong Hoon Lee, K.S. Min, S.I. Kim, S. Ha, Dong Geun Shin
Abstract: SiC powders having different purities were prepared by carbothermal reduction under different conditions from traditional process and SiC single crystals were grown by the PVT method from the powders. After crystal growth, boule was cut to wafers and they were polished for chemical and defect analyses. Total impurities including Al, B and Ti which were derived from powders decreased remarkably during crystal growth. The formation of defects including micropipe and dislocations such as TED, TSD and BPD was strongly influenced by impurity content. The effect of impurity seemed to be negligible at below 1ppm level for MPD. On the other hand, dislocations continuously decreased even more when higher purity SiC powder below 1ppm level was used.
85
Authors: Atsuto Okamoto, Naohiro Sugiyama, Toshihiko Tani, Nobuo Kamiya
21
Authors: Zhu Qing Zhang, Kang Lin Xing
Abstract: Through experimental study on the role of the free abrasive in chemical mechanical polishing, in this paper, four different types of abrasive which were chosen were used for the research of material removal rate(MRR) and surface quality of SiC single crystal . Finally ,Diamond abrasive which is considered was the most suitable for chemical mechanical polishing(CMP) abrasive of SiC Crystal Substrate. With diamond Particle polish pad polishing, it is draw a comparison result on the influence of the free abrasive and consolidation abrasive for the material removal rate and surface quality of 6H-SiC. The results showed that: the MRR is 140nm / min, the material removal rate if fixed abrasive chemical mechanical polishing(FA-CMP) more than three times that of traditional CMP, fixed abrasive chemical mechanical polishing pad, are involved in a large proportion of micro abrasive cutting, can greatly improve the material removal efficiency. And results from the test procedure, the FA-CMP surface has scratches after more technical problems for the polishing pad, the surface damage is relatively free of abrasive chemical mechanical polishing is more serious.
244
Showing 1 to 3 of 3 Paper Titles