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Fabrication of Nanoabrasive Grinding Wheels and Their Application to Grinding Silicon Wafers

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Abstract:

In the surface machining of brittle materials, there exists a transition from brittle to ductile modes when the depth of cut is reduced below a critical size using ultrafine abrasive grains. Vitrified grinding wheels containing ultrafine abrasives in the sub-micrometer to nanometer range were fabricated by mechanochemically milling nanoabrasive particles and subsequent viscous sintering of abrasive-binder composites. The grinding characteristics of the nanoabrasive grinding wheels were evaluated for the fine grinding of silicon wafers in terms of a variety of variables. Preliminary wafer grinding results are presented on material removal rate and surface quality of silicon wafers.

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Periodical:

Key Engineering Materials (Volumes 317-318)

Pages:

373-376

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.317-318.373

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Online since:

August 2006

Authors:

T.W. Kim, Sang Hoon Hyun, Joo Sun Kim, Jong Ho Lee, Hae Won Lee

Keywords:

Grinding Wheel, Mechanochemical Mixing, Nanoabrasive, Surface Quality, Vitrified Bond

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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