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Effect of SiO2 Cap Layer on Thermal Stability of Nickel and Nickel-Cobalt Silicide

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Abstract:

We investigated the effect of SiOcap layer on the thermal stability of nickel and nickel-cobalt silicide by measuring its sheet resistance. The stability of nickel silicide was deteriorated as a function of annealing temperature, while that of nickel-cobalt silicide was not. In case of both silicides, the SiOcap layer improved the stability. Tensile stress from the difference of thermal expansion coefficients between SiO2 and nickel silicide may suppress the agglomeration of nickel silicide.

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Periodical:

Key Engineering Materials (Volumes 321-323)

Pages:

1322-1325

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.321-323.1322

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Online since:

October 2006

Authors:

Kil Jin Han, Yu Jeong Cho, Soon Young Oh, Yong Jin Kim, Won Jae Lee, Hi Deok Lee, Yeong Cheul Kim

Keywords:

Nickel Silicide, SiO2 Cap Layer, Thermal Expansion Coefficient, Thermal Stability

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] S. P. Muraka D. B. Fraser: J. Appl. Phys. Vol. 51 (1980), p.342.

Google Scholar

[2] K. Maex: Appl. Surf. Sci. Vol. 53 (1991), p.328.

Google Scholar

[3] C. J. Choi, Y. W. OK, T. Y. Seong and H. D. Lee: Jpn J. Appl. Phys. Pt. Vol. 141 (2002).

Google Scholar

[4] J. S. Maa, D. J. Tweet, Y. Ono, L. Stecker and S. T. Hsu: Mater. Res. Symp. Proc. Vol. 670 (2001), p.691.

Google Scholar

[5] C. -J. Choi, Y. -W. Ok, T. -Y. Seong, and H. -D. Lee: J. Appl. Phys., Vol. 41 (2002), p. (1969).

Google Scholar

[6] C. Detavernier, Co. Lavoie, and F. M. d'Heurle: J. Appl. Phys, Vol. 93 (2003), p.2510.

Google Scholar

[7] S. Wolf and R.N. Tauber: Silicon Processing for the VLSI Era: Volume 1 - Process Technology (Lattice Press, CA 1986).

Google Scholar

[8] H. Kahn, M.A. Huff, and A.H. Heuer: Mat. Res. Soc. Symp. Proc., Vol 518 (1998), p.33.

Google Scholar