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Second-Order Elasto-Plastic Analysis of Frames by Differential Quadrature Element Method
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Reliability Analysis for Effects of Reservoir Water Level Change on Embankment Dam
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Pattern Shifting Analyses of Micro-Structures of IC Package
p.1333
Analysis of Hydrogen Diffusion in Notched High-Strength Steel Wires
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Study on Calculation Method of Press Straightening Stroke Based on Straightening Process Model
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Stress Testing of Individual Steel Strands in a Multiple-Cable Single Borehole Anchorage for Geotechnical Engineering
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Pattern Shifting Analyses of Micro-Structures of IC Package

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Abstract:

Pattern shift is one of the main failures of micro-electronics. In this paper, the influence of plastic deformation values of micro-structures of IC packages on the pattern shift of metal lines is studied by maximum plastic strain theory using a certain 2D FEM model with different design parameters, “d”, “w”, “t_epo”, “t_Teos”, “t_glue” “sy_glue” and “sy_al”. For different critical process step, the final process temperature is acted as a representative parameter to analyze its impact. Furthermore, Response Surface Model (RSM) of plastic strains is established using any two design parameters. Results show that “w”, “t_epo”, “t_Teos”, “t_glue” “sy_glue” and “sy_al” will have different influence on pattern shifting while “d” have little impact.

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Periodical:

Key Engineering Materials (Volumes 340-341)

Pages:

1333-1338

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.340-341.1333

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Online since:

June 2007

Authors:

Yu Ting He, Rong Shi, Hong Peng Li, Feng Li, G.Q. Zhang, L.J. Ernst

Keywords:

Influence of Geometry, Package, Pattern Shifting, Plastic Strain, Response Surface Model

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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