Paper Titles
Implicit Stress Integration for High-Temperature Inelastic Constitutive Models Using Linearization
p.907
Processing Conditions and Mechanical Properties of Fine Grained Mg by Equal Channel Angular Pressing
p.913
Comparison of Age-Hardening Characteristic in Thixo-Cast and Rheo-Cast T5-A356 Alloys by Nanoindenter and AFM
p.919
Experimental Study on Mechanical Energy Hysteresis in Nano Colloidal Damper Using Porous Silica Particle
p.925
Thermal Imprint Process of Parylene for MEMS Applications
p.931
Grain Refinement and Strengthening of a Cylindrical Pure-Aluminum Specimen by Using Modified Equal-Channel Angular Pressing Technique
p.937
Fatigue Damage Mechanism of Nanocrystals in ECAP-Processed Copper Investigated by EBSD and AFM Hybrid Methods
p.943
Molecular Dynamics Simulation on Crack Initiation at Bi-Material Interface Edges
p.949
A New Method for Stress and Deformation Analysis from Nano to Macro Dimensional Scales
p.955

Thermal Imprint Process of Parylene for MEMS Applications

Article Preview

Abstract:

This study investigated a thermal imprint technique to pattern parylene microstructures over an area of 2525 mm2. A nickel mold having arrays of 25 m-high, 10 m-wide and 1 mm-long lines with 10 m spacing was fabricated using the deep RIE silicon etching followed by the electroplating process. Imprint tests were then carried out under different conditions of temperature, imprint-hold time and applied pressure to investigate a thermal imprint condition for the complete filling of parylene. Good release results without damage or deformation in parylene microstructures were achieved by the help of a release agent in the imprint temperature range of 160 oC to 250oC. With increasing temperature, the depths of imprinted structures increased and their distribution came to be homogeneous. Complete filling was obtained under the imprint temperature of 250oC, applied load of 195 kgf (3 MPa) and imprint hold time of 1800 s.

You might also be interested in these eBooks
Engineering Plasticity and Its Applications View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 340-341)

Pages:

931-936

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.340-341.931

Citation:

Cite this paper

Online since:

June 2007

Authors:

Sung Won Youn, Hiroshi Goto, Masaharu Takahashi, M. Ogiwara, Ryutaro Maeda

Keywords:

Delamination, Micro-Electromechanical System (MEMS), Nanoimprint, Ni Mold, Parylene C

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] Y. Suzuki, Y. -C. Tai, in: The 16th IEEE Int. Conf. on MicroElectroMechanical Systems (MEMS2003), 19-23 Jan., Kyoto, Japan, 2003, p.486.

Google Scholar

[2] T. -J. Yao, K. Walsh, Y. -C. Tai, in: The 15th IEEE. Int. Conf. on MEMS (MEMS2002), Las. Vegas, Nevada, USA, Jan. 20-24, 2002, p.614.

Google Scholar

[3] M. Liger, D. Rodger and Y. -C Tai, in: The 16th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS '03), Kyoto, Japan, Jan. 19-23, (2003) p.602.

DOI: 10.1109/memsys.2003.1189821

Google Scholar

[4] E. Meng, Y. -C. Tai, Parylene etching techniques for microfluidics and bioMEMS, in: The 18th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS , 05), Miami, USA, Jan. 30 - Feb. 3, (2005) p.568.

DOI: 10.1109/memsys.2005.1453993

Google Scholar

[5] H. -S. Noh, P.J. Hesketh, G.C. Frye-Mason: J. Microelectromech. Syst. Vol. 11 (6) (2002) p.718.

Google Scholar

[6] H. -S. Noh, Y. Huang, P.J. Hesketh: Sensor. Actuat. B Vol. 102 (2004) p.78.

Google Scholar

[7] H.D. Rowland, W.P. King: J. Micromech. Microeng., Vol. 14 (2004) p.1625.

Google Scholar

[8] K. Deguchi, N. Takeuchi and A. Shimizu: Jpn. J. Appl. Phys. Vol. 41 (2002), p.4178.

Google Scholar

[9] H. -C. Scheer, H. Schulz: Microelectron. Eng. Vol. 56 (2001), p.311.

Google Scholar