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Effect of Low Temperature Rolling on Microstructure and Properties of ECAE Processed Copper
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Effect of Low Temperature Rolling on Microstructure and Properties of ECAE Processed Copper

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Abstract:

The changes in the tensile properties, in relation to the phenomenon of shear banding are investigated in copper, rolled at liquid nitrogen temperature and then recrystallized, after initial processing by Equal-Channel Angular Extrusion (ECAE) at room temperature. Increases in ductility and strength up to the fourth pass of ECAE processing were noted, then a decrease of both properties was observed. The decrease was accompanied by twinning and shear banding. In rolled samples, pre-cooled down to the temperature of liquid nitrogen and initially recrystallized, the twinning and shear banding mechanisms were the most probable mechanisms responsible for lowering the mechanical properties.

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Periodical:

Materials Science Forum (Volume 550)

Pages:

283-288

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.550.283

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Online since:

July 2007

Authors:

J. Kusnierz

Keywords:

Copper (Cu), Equal Channel Angular Extrusion (ECAE), Low-Temperature, Rolling

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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