Paper Titles
Preface
Effect of Changing Strain Rate during Warm Deformation on Static Recrystallisation of IF Steel
p.3
The Application of Multiscale Modelling for the Prediction of Plastic Anisotropy and Deformation Textures
p.13
Simulation of Rolling and Recrystallization Textures in Aluminium Alloy Sheets
p.23
Evolution of the Grain Boundary Network as a Consequence of Deformation and Annealing
p.35
Modelling the Precipitation of Al3X Dispersoids in Aluminium Alloys and their Effect on Recrystallization
p.45
On the Viability of FIB Tomography for Generating 3-D Orientation Maps in Deformed and Annealed Metals
p.55
Correlating Microstructural Features and Surface Roughening in Ferritic Stainless Steel
p.65
Heterogeneous Deformation and Internal Stresses Developed in BCC Wires by Axisymmetric Elongation
p.75

Evolution of the Grain Boundary Network as a Consequence of Deformation and Annealing

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Abstract:

Iterative processing, involving sequential deformation and annealing, has been carried out on copper specimens with the aim of grain boundary engineering (GBE) them. The data have provided some interesting insights into the mechanisms of GBE. The results have demonstrated that development of a high proportion of Σ3s is beneficial to properties, as shown by improved strain-to-failure for the same strength. The proportion of Σ3s saturates at approximately 60% length fraction. Analysis of the data indicates that iterative processing is not always necessary for the development of beneficial properties, and it is further suggested that the condition of the starting specimen has a large influence on the subsequent microstructural development. The present, new data are also compared with previous research on copper where all five parameters of the grain boundary network population have been measured.

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Periodical:

Materials Science Forum (Volume 550)

Pages:

35-44

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.550.35

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Online since:

July 2007

Authors:

Valerie Randle, Mark Coleman, Gregory Owen

Keywords:

Electron Backscatter Diffraction (EBSD), Five Parameter Analysis, Grain Boundary Engineering, Grain Boundary Plane, Twinning

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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