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Effect of Low-Temperature Recovery Treatments on Subsequent Recrystallization in Al-2.5%Mg
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Grain Boundary Migration and Compensation Effect
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Grain Boundary Migration and Compensation Effect

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Abstract:

Anisotropy of grain boundary motion in a Fe–6at.%Si alloy is represented by a spectrum of values of the activation enthalpy of migration and the pre-exponential factor, depending on the orientation of individual grain boundaries. The general plot of these values exhibits a pronounced linear interdependence called the compensation effect. It is shown that changes of these values, caused by changes of intensive variables, are thermodynamically consistent.

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Periodical:

Materials Science Forum (Volume 550)

Pages:

387-392

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.550.387

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Online since:

July 2007

Authors:

Pavel Lejček

Keywords:

Anisotropy of Grain Boundary Migration, Compensation Effect, Thermodynamic

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] A.P. Sutton and R.W. Balluffi: Interfaces in Crystalline Solids, (Clarendon, Oxford, 1995).

Google Scholar

[2] P. Cotterill and P.R. Mould: Recrystallization and Grain Growth in Metals (Surrey University Press, 1976).

Google Scholar

[3] T. Watanabe, Res Mech. Vol. 11 (1984), p.47.

Google Scholar

[4] P. Lejček, S. Hofmann and V. Paidar: Acta Mater. Vol. 51 (2003), p.3951.

Google Scholar

[5] G. Gottstein and L.S. Shvindlerman: Grain Boundary Migration in Metals: Thermodynamics, Kinetics, Applications (CRC Press, Boca Raton, 1999).

DOI: 10.1201/9781420054361

Google Scholar

[6] P. Lejček and J. Adámek: J. Phys. IV Vol. 5 (1995), C3, p.107.

Google Scholar

[7] P. Lejček: Z. Metallkde Vol. 96 (2005), p.1129.

Google Scholar

[8] P. Lejček, V. Paidar, J. Adámek and S. Kadečková: Interface Sci. Vol. 1 (1993), p.187.

Google Scholar

[9] M. Furtkamp, P. Lejček and S. Tsurekawa: Interface Sci. Vol. 6 (1998), p.59.

Google Scholar

[10] S. Kadečková, P. Toula and J. Adámek: J. Crystal Growth Vol. 83 (1987), p.410.

Google Scholar

[11] M. Polcarová, J. Brádler, A. Jacques, P. Lejček, A. George, O. Ferry: J. Phys. D: Appl. Phys. Vol. 36 (2003), p. A98.

Google Scholar

[12] M.S. Masteler and C.L. Bauer: in: Recrystallization of Metallic Materials, (Riederer, Stuttgart, 1978) p.251.

Google Scholar

[13] V. Havlová, P. Lejček: Mater. Sci. Forum Vol. 482 (2005), p.199.

Google Scholar