Microstructure and Texture of Dynamically Recrystallized Copper and Copper – Tin Alloys

D.T. McDonald; John F. Humphreys; Pete S. Bate

doi:10.4028/www.scientific.net/MSF.550.393

Paper Titles

A Criterion for Conventional Dynamic Recrystallization: Application to Magnesium Alloys
p.369

Influence on Annealing Treatments on Twins in Magnesium Alloy AZ31
p.375

Effect of Low-Temperature Recovery Treatments on Subsequent Recrystallization in Al-2.5%Mg
p.381

Grain Boundary Migration and Compensation Effect
p.387

Microstructure and Texture of Dynamically Recrystallized Copper and Copper – Tin Alloys
p.393

The Microstructure Evolution of Copper and Gold Bonding Wires during Annealing
p.399

Pinning Forces Exerted by TiN Particles in Austenite of Structural Steels and Comparison with Driving Forces for Grain Growth and for Static Recrystallisation
p.405

Structural Dependence of Grain Boundary Energy in Fe-Based Polycrystals Identified by OIM Measurements
p.411

Static Recrystallization of Austenite in a Medium-Carbon Vanadium Microalloyed Steel and Inhibition by Strain-Induced Precipitates
p.417

HomeMaterials Science ForumMaterials Science Forum Vol. 550Microstructure and Texture of Dynamically...

Microstructure and Texture of Dynamically Recrystallized Copper and Copper – Tin Alloys

Abstract:

The microstructure and texture in dynamically recrystallized copper and two copper – tin alloys (2wt% and 4.5wt% tin) has been investigated. Specimens were deformed in channel-die plane strain compression to true strains from 0.1 to 1.22 within the temperature range 200°C to 700°C, and the resulting microstructures were investigated with the use of high resolution electron backscatter diffraction (EBSD). Dynamic recrystallization was initiated by the bulging of preexisting high angle grain boundaries (HAGB), and occurred primarily by strain induced boundary migration (SIBM) and twinning. The addition of tin led to an increase in the temperature at which dynamic recrystallization initiated, and furthermore to a smaller dynamically recrystallized grain size. This was attributed to the effects of solute drag causing lower HAGB mobility. Dynamic recrystallization was observed to weaken the deformation texture components of brass and Goss, as well as introduce a cube texture component which generally tended to strengthen with temperature but weaken with increasing tin additions.