Texture Evolution during High Temperature Plane Strain Compression of High Silicon Steels

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High silicon steel is used for electrical applications because its electrical resistivity is increased and the magnetostriction is reduced. A silicon content up to 6.5 wt.-% gives excellent magnetic properties. The improvement of the magnetic properties stays in contrast with the lack of ductility of these alloys, making their thermo-mechanical processing difficult. The optimum final microstructure and texture depends on the final application of the material: extremely big grains with a Goss orientation ({110} <001>) are desired in transformers and grains with an average size of 100 -m and cube component ({100} <001>) are used in electrical motors. A series of plane strain compression (PSC) tests were performed on 3 electrical steels, with a silicon content from 1.8 to 4.1 wt.-%, in a temperature range of 800 to 1100°C, strain rates between of 0.5 and 5 s-1. Reductions and time between deformation and quenching were also varied in order to study the recrystallisation progress. Apparent activation energies for hot working, calculated using the hyperbolic sine equation, was in good agreement with literature and higher than the activation energy for self diffusion in iron. These values increase with the silicon content. The high temperature texture evolution was investigated by means of electron back scattering Diffraction (EBSD) technique, which allows the quantification of important texture components in function of the thermo-mechanical parameters applied during hot rolling and the plane strain compression tests. The hot rolled microstructures have shown an average grain size of 140 -m and a texture with a maximum on the cube fibre ({001} <-1-10>). The conventional α (<110> // RD) / γ (<111> // ND) fibre texture was developed after plane strain compression and their intensities depend on the deformation temperature and reduction. A similar tendency was observed for the fraction of static recrystallised grains.

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15-20

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August 2007

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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