Paper Titles
Equivalent Circuits of Unipolar Pulsed Plasma System for Electrical and Optical Signal Analysis
p.89
Structural and Magnetic Properties of the Zn-Mn-O System
p.95
Modeling and Investigation of SiGe Based MOSFET Structure Transport Characteristics
p.101
Simulation Study of Granular Compaction Dynamics under Vertical Tapping
p.107
Plasma Etching for the Application to Low-K Dielectrics Devices
p.113
Relevance of Polaron/Soliton-Like Transport Mechanisms in Cascade Resonant Isomeric Transitions of Q1D-Molecular Chains
p.119
Conduction Mechanism Based Model of Organic Field Effect Transistor Structure
p.125
Theoretical Assessment of Calcium Arsenates Stability: Application in the Treatment of Arsenic Contaminated Waste
p.131
Characterization of Target Material for X-Ray Generator by Monte Carlo Method
p.137

Plasma Etching for the Application to Low-K Dielectrics Devices

Article Preview

Abstract:

We present a study of the photoresist (PR) etching and the low-k materials damage using a ferrite-core inductively coupled plasma (ICP) etcher, in order to develop an etching process for the low-k dielectric devices. We reveal that the N2/O2 flow ratio and bias power affected the PR etching rate. By Fourier transform infrared spectroscopy and HF dipping test, we investigated the effect of the gas flow ratio and bias power on the amount of etching damage to the low-k material.

You might also be interested in these eBooks
Research Trends in Contemporary Materials Science View Preview

Info:

Periodical:

Materials Science Forum (Volume 555)

Pages:

113-118

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.555.113

Citation:

Cite this paper

Online since:

September 2007

Authors:

Jong Woo Lee, Hyoun Woo Kim, Jeong Whan Han, Mok Soon Kim, Byung Don Yoo, M.H. Kim, C.H. Lee, C.H. Lee, Cheol Ho Lim, Sun Keun Hwang, C. Lee, D.J. Chung, S.G. Park, S.G. Lee, B.H. O, J. Kim, S.P. Chang, S.H. Lee, Seung Yong Chai, Wan In Lee, S.E. Park, K. Kim, D.K. Choi, C.W. Chung

Keywords:

ICP, Low-K Material, Photoresist

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] T.C. Chang, P.T. Liu, Y.J. Mei, Y.S. Mor, T.H. Perng, Y.L. Yang and S.M. Sze: J. Vac. Sci. Technol. B Vol. 17 (1999), p.2325.

Google Scholar

[2] P.T. Liu, T.C. Chang, Y.S. Mor and S.M. Sze: Jpn. J. Appl. Phys. Vol. 38 (1999), p.3482.

Google Scholar

[3] S.A. Vitale and H.H. Sawin: J. Vac. Sci. Technol. A Vol. 20 (2002), p.651.

Google Scholar

[4] Y.H. Kim, H.J. Kim, J.Y. Kim and Y. Lee: J. Korean Phys. Soc. Vol. 40 (2002), p.94.

Google Scholar

[5] K. Yonekura, S. Sakamori, K. Goto, M. Matsuura, N. Fujiwara and M. Yoneda: J. Vac. Sci. Technol. B Vol. 22 (2004), p.548.

DOI: 10.1116/1.1651111

Google Scholar

[6] S. Lloyd, D.M. Shaw, M. Watanabe and G.J. Collins: Jpn. J. Appl. Phys. Vol. 38 (1999), p.4275.

Google Scholar

[7] E.L. Boyd: J. Appl. Phys. Vol. 39 (1968), p.1304.

Google Scholar

[8] F.G. Hewitt: J. Appl. Phys. Vol. 40 (1969), p.1464.

Google Scholar

[9] K. Takata, F. Tomiyama and Y. Shiroishi: J. Magn. Magn. Mater. Vol. 269 (2004), p.131.

Google Scholar

[10] I. Ganachev and H. Sugai: Surf. Coat. Technol. Vol. 174-175 (2003), p.15.

Google Scholar

[11] K. Hou, S. Nakagarni and T. Makabe: Thin Solid Films Vol. 386 (2001), p.239.

Google Scholar

[12] H.W. Kim, J.H. Myung, N.H. Kim, H.S. Lee, S. -G. Park, J.G. Lee, C.W. Chung, W.J. Park, C. -J. Kang, C. -G. Yoo, K. -H. Ko, J. -H. Woo, S. -D. Choi and D. -K. Choi: Thin Solid Films Vol. 506-507 (2006), p.222.

DOI: 10.1016/j.tsf.2005.08.089

Google Scholar